IP Library › Granted Patent US 7,097,677
Granted Patent B2
US 7,097,677 · App. 10/629,206 · Granted Aug 29, 2006

Polishing slurry

Assignee: Nihon Microcoating Co., Ltd.
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Quick Facts
Patent No.
US 7,097,677
App. No.
10/629,206
Granted
Aug 29, 2006
Kind
B2
Abstract

Polishing slurry has abrading particles dispersed in a liquid dispersant. The abrading particles are composite particles each having a first particle and a plurality of second particles smaller than the first particles attached to the surface of the first particle through a metal oxide membrane. The first particles have average diameter of 0.1–20 μm and the second particles have average diameter of 0.001–0.5 μm. Elastic particles may be used as the first particles such as polymer particles.

Claims (4)

1. Polishing slurry comprising:

abrading composite particles each having a first particle and a plurality of second particles smaller than said first particles attached to surface of said first particle through a metal oxide membrane;

third particles which are smaller than said first particles; and a liquid dispersant dispersing said composite particles and said third particles;

wherein the first particles are silicon particles and have average diameter of 0.1–20 μm, wherein the second particles are silica particles and have average diameter of 0.001–0.5 μm, and wherein the third particles have average diameter of 0.001 –0.5 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2003
From: YOKOI, NORIAKI
To: NIHON MICROCOATING CO., LTD.
Reel/Frame 014339/0074 →
Continuity (1)
Related Publication 20040020132A1 · Feb 5, 2004