IP Library Granted Patent US 7,103,271
Granted Patent B2
US 7,103,271 · App. 11/000,223 · Granted Sep 5, 2006

Light irradiation heat treatment method and light irradiation heat treatment apparatus

Assignee: Matsushita Electric Industrial Co., Ltd.
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Quick Facts
Patent No.
US 7,103,271
App. No.
11/000,223
Granted
Sep 5, 2006
Kind
B2
Abstract

A light irradiation heat treatment apparatus and method may use a plane-shaped light irradiation heating component, facing one surface of a workpiece supported in a furnace, to raise the temperature of the workpiece. The temperature of the workpiece is raised by setting an intensity distribution for light irradiated from the light irradiation heating component in accordance with the resistivity of the workpiece. Thereafter, the workpiece is irradiated with light having the set light intensity distribution to raise its temperature.

Claims (29)

1. A light irradiation heat treatment method for a workpiece supported in a furnace, in which a plane-shaped light irradiation heating component faces one surface of the workpiece, the method comprising:

setting an intensity distribution for light irradiated from the light irradiation heating component in accordance with the resistivity of the workpiece; and

irradiating light having the set light intensity distribution toward the workpiece to raise the temperature of the workpiece.

2. The method of claim 1 , wherein the intensity distribution for the light is set for a flatly uniform intensity distribution when the resistivity of the workpiece is less than 1 ohm-cm.

3. The method of claim 1 , wherein the intensity distribution for the light is set such that the light intensity of a peripheral portion of the distribution is less than that of a central portion when the resistivity of the workpiece is not less than 1 ohm-cm.

4. The method of claim 1 , further comprising:

raising the temperature of the workpiece by setting the light intensity of a peripheral portion of the distribution less than that of a central portion and irradiating the workpiece with the set intensity distribution;

irradiating, after raising the temperature of the workpiece using the non-uniform intensity distribution, the workpiece with light having a flatly uniform intensity distribution; and

heat-treating the workpiece.

5. The method of claim 4 , wherein the flatly uniform light intensity distribution provided by the light irradiation heating component has the geometric form of a concentric circle-shaped distribution and this distribution is irradiated onto a circle-shaped workpiece having a resistivity that is not less than 1 ohm-cm.

6. A light irradiation heat treatment apparatus comprising:

a support element for supporting a workpiece provided in a furnace;

a plane-shaped light irradiation heating component that faces one surface of the workpiece;

a temperature measuring component that faces the surface on the other side with respect to the one surface of the workpiece; and

a light irradiation intensity control component that controls a light irradiation intensity distribution, in a plane of the light irradiation heating component, based on the resistivity of the workpiece, when raising the temperature of the workpiece.

7. A light irradiation heat treatment apparatus comprising:

a support element for supporting a workpiece provided in a furnace;

a plane-shaped light irradiation heating component that faces one surface of the workpiece;

a temperature measuring component that faces the surface on the other side with respect to the one surface of the workpiece;

a resistivity measurement component that measures the resistivity of the workpiece; and

a light irradiation intensity control component that controls a light irradiation intensity distribution, in a plane of the light irradiation heating component, based on the measured resistivity of the workpiece, when raising the temperature of the workpiece.

8. The light irradiation heat treatment apparatus according to any one of claims 6 or 7 , wherein the light irradiation heating component consists of a group of heat lamps that are flatly arranged, such that the group of the heat lamps is split into a plurality of flat areas and the light irradiation intensity for each area may be set independently of the other areas.

9. The light irradiation heat treatment apparatus according to any one of claims 6 or 7 , wherein the light irradiation intensity control component controls the intensity distribution for the light such that:

a flatly uniform intensity distribution is applied to raise the temperature of the workpiece when the resistivity of the workpiece is less than 1 ohm-cm, and

a varying intensity distribution is applied to raise the temperature of the workpiece when the resistivity is not less than 1 ohm-cm.

10. The light irradiation heat treatment apparatus of claim 8 , wherein the group of heat lamps is split into a plurality of areas that each have the shape of a flatly concentric circle and the light provided by the heat lamps is irradiated onto a semiconductor substrate workpiece.

11. The light irradiation heat treatment apparatus of claim 9 , wherein the group of heat lamps is split into a plurality of areas that each have the shape of a flatly concentric circle and the light provided by the heat lamps is irradiated onto a semiconductor substrate workpiece.

12. The method of claim 1 , further comprising raising the temperature of the workpiece by setting the light intensity of a peripheral portion of the distribution less than that of a central portion and irradiating the workpiece with the set intensity distribution; irradiating, after raising the temperature of the workpiece using the non-uniform intensity distribution, the workpiece with light having a flatly uniform intensity distribution; and heat-treating the workpiece, wherein the flatly uniform light intensity distribution provided by the light irradiation heating component has the geometric form of a concentric circle-shaped distribution and this distribution is irradiated onto a circleshaped workpiece having a resistivity that is not less than 1 ohm-cm.

13. The method of claim 3 , further comprising raising the temperature of the workpiece by setting the light intensity of a peripheral portion of the distribution less than that of a central portion and irradiating the workpiece with the set intensity distribution; irradiating, after raising the temperature of the workpiece using the non-uniform intensity distribution, the workpiece with light having a flatly uniform intensity distribution; and heat-treating the workpiece, wherein the flatly uniform light intensity distribution provided by the light irradiation heating component has the geometric form of a concentric circle-shaped distribution and this distribution is irradiated onto a circle-shaped workpiece having a resistivity that is not less than 1 ohm-cm.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2020
From: PANNOVA SEMIC, LLC
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 053755/0859 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2015
From: PANASONIC CORPORATION
To: PANNOVA SEMIC, LLC
Reel/Frame 036065/0273 →
CHANGE OF NAME Recorded Sep 19, 2014
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 033777/0873 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2004
From: KANAZAKI, EMI; SHIBATA, SATOSHI; KAWASE, FUMITOSHI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 016047/0645 →
Priority Claims (1)
JP 2004-011841 · Jan 20, 2004 · national
Continuity (1)
Related Publication 20050173386A1 · Aug 11, 2005