Waveguide interconnection apparatus
View Patent ↗Provided is a waveguide interconnection apparatus making rectangular interconnecting portions to be a curved structure, whereby it is possible to reduce a signal reflection and a signal loss due to a mismatch occurred from a discontinuous portion where waveguides are perpendicularly connected to each other, and fabricate package products having excellent performances compared to that of the prior art in the same chip and structure.
1. A waveguide interconnection apparatus, comprising:
a first housing having a first waveguide therein;
a second housing having a second waveguide connected to the first waveguide; and
a third housing having a third waveguide connected to the second waveguide,
wherein a signal propagated from the first waveguide through the second waveguide to the third waveguide is reflected to have a predetermined angle when it passes an interconnecting portion of each waveguide, and both inner connecting portions and outer connecting portions between the first waveguide and the second waveguide, and between the second waveguide and the third waveguide is curved
wherein the second waveguide separately consists of a first portion connected to the first waveguide, a second portion connected to the first portion, and a third portion connected to the second portion and the third waveguide; and
wherein the first portion, the second portion and the third portion are made to be curved, linear, and curved, respectively.
2. The waveguide interconnection apparatus as claimed in claim 1 , wherein the signal is an ultrahigh frequency signal.
3. The waveguide interconnection apparatus as claimed in claim 1 , wherein the first and third housings are made in such a manner that a rectangular parallelepiped structure made of a conductive material is punched to form rectangular parallelepiped waveguides.
4. The waveguide interconnection apparatus as claimed in claim 1 , wherein the second housing is made in such a manner that a rectangular parallelepiped structure made of a conductive material is punched to form a rectangular parallelepiped waveguide.
5. A waveguide interconnection apparatus, comprising:
a first housing having a first waveguide therein;
a second housing having a second waveguide connected to the first waveguide; and
a third housing having a third waveguide connected to the second waveguide,
wherein a signal propagated from the first waveguide through the second waveguide to the third waveguide is reflected to have a predetermined angle when it passes an interconnecting portion of each waveguide, and both inner connecting portions and outer connecting portions between the first waveguide and the second waveguide, and between the second waveguide and the third waveguide is curved
wherein the second waveguide separately consists of a first portion connected to the first waveguide, a second portion connected to the first portion, and a third portion connected to the second portion and the third waveguide; and
wherein the first and third portions are bonded to a cover after to form a rectangular parallelepiped structure.
6. The waveguide interconnection apparatus as claimed in claim 5 , wherein the first and third housings are made in such a manner that a rectangular parallelepiped structure made of a conductive material is punched to form rectangular parallelepiped waveguides.
7. The waveguide interconnection apparatus as claimed in claim 5 , wherein the second housing is made in such a manner that a rectangular parallelepiped structure made of a conductive material is punched to form a rectangular parallelepiped waveguide.
8. The waveguide interconnection apparatus as claimed in claim 5 , wherein the signal is an ultrahigh frequency signal.