Encapsulated electronic sensor package
An electronic package includes a circuit board and a capsule layer encasing the circuit board and forming an immersible electronic module. A housing receives the electronic module and forms a protective shell around the electronic module.
1. An electronic package comprising:
a circuit board;
a compressible capsule layer encasing said circuit board and in intimate contact therewith, thereby forming a sealed immersible electronic module; and
a housing receiving an outer surface of and press fit to said encapsulated electronic module and forming a protective shell around said electronic module with press fit engagement.
2. An electronic package in accordance with claim 1 wherein said circuit board includes at least one sensor coupled thereto.
3. An electronic package in accordance with claim 2 wherein said sensor is a hall effect sensor.
4. An electronic package in accordance with claim 1 wherein said compressible capsule layer comprises a melt processsible rubber.
5. An electronic package in accordance with claim 1 wherein said housing comprises a longitudinal axis and an elongated opening extending transverse to said longitudinal axis for adjusting a position of said housing.
6. An electronic package in accordance with claim 1 wherein said housing comprises a mounting stud.
7. An electronic package in accordance with claim 1 , wherein said housing comprises at least one indicator bar.
8. An electronic package in accordance with claim 1 wherein one of said capsule layer and said housing comprises a latch configured to engage the other of said capsule layer and said housing.
9. An electronic package in accordance with claim 1 further comprising a magnetic plate, said magnetic plate positioned beneath said circuit board and encased in said capsule layer.