IP Library Granted Patent US 7,130,696
Granted Patent B2
US 7,130,696 · App. 10/956,105 · Granted Oct 31, 2006

Percutaneous electrode array

Assignee: Biowave Corporation
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Quick Facts
Patent No.
US 7,130,696
App. No.
10/956,105
Granted
Oct 31, 2006
Kind
B2
Abstract

A method of producing percutaneous electrode array is disclosed for applying therapeutic electrical energy to a treatment site in the body of a patient. The array comprises a plurality of electrode microstructures which are inserted into the epidermis, thereby overcoming the inherent electrical impedance of the outer skin layers and obviating the need to prepare the skin surface prior to an electro-therapy treatment. The array preferably includes an adhesion layer to help keep the electrode microstructures inserted into the epidermis during the duration of the therapeutic treatment, and temperature and condition monitoring devices to ensure proper treatment and enhance patient safety.

Claims (15)

1. A method of producing a percutaneous electrode array comprising:

micromachining a master mold of a perctaneous electrode array having a substrate and a plurality of electrodes from silicon using semiconductor lithographic processing;

creating a replica mold by electroplating thin film silver followed by nickel onto the master mold;

heating, softening, and rolling a polymeric film;

forcing the film into the replica mold using pressure to form an array structure; and

cooling the array structure and removing the structure from the replica mold.

2. The method of claim 1 , further comprising:

thermally processing array material to form a carbonized structure; and

depositing an adhesive layer on the structure.

3. The method of claim 1 , wherein the polymeric film comprises polymethyl methacrylate.

4. The method of claim 1 , further comprising spraying conductive inks onto the structure and heating the structure to form a conductive coating.

5. The method of claim 1 , further comprising:

spraying, dipping or spin coating an indium tin oxide precursor onto the array structure; and

heating the structure to form a conductive film coating.

6. The method of claim 1 , further comprising forming a conductive film comprising indium tin oxide by evaporation or sputtering processes onto the array structure.

Assignments (2)
SECURITY INTEREST Recorded Aug 3, 2022
From: BIOWAVE CORPORATION
To: CONNECTICUT INNOVATIONS, INCORPORATED
Reel/Frame 060709/0205 →
SECURITY INTEREST Recorded Jan 30, 2020
From: BIOWAVE CORPORATION
To: CONNECTICUT INNOVATIONS, INCORPORATED
Reel/Frame 051675/0225 →
Continuity (5)
Division 1045969500 · Jun 10, 2003
Continuation In Part 0975699900 · Jan 8, 2001
Provisional Application 6017500300 · Jan 7, 2000
Provisional Application 6018325800 · Feb 17, 2000
Related Publication 20050043775A1 · Feb 24, 2005