Semiconductor light emitting device capable of suppressing silver migration of reflection film made of silver
A luminous lamination structure includes a first layer made of n-type nitride semiconductor and a second layer made of p-type nitride semiconductor and disposed over the first layer wherein a luminous region is defined between the first and second layers. The second layer is removed to expose the first layer in a first area which is a partial surface of the first layer. A p-side electrode is disposed on a surface of the second layer and electrically connected to the second layer. An insulating film covers the p-side electrode. An n-side electrode electrically connected to the first layer is disposed in the first area. A reflection film disposed on the insulating film extends to the n-side electrode and electrically connected to the n-side electrode. The reflection film is made of silver containing alloy or silver.
1. A semiconductor light emitting device comprising:
a luminous lamination structure including a first layer made of n-type nitride semiconductor and a second layer made of p-type nitride semiconductor and disposed over the first layer, wherein a luminous region is defined between the first and second layers and the second layer is removed to expose the first layer in a first area which is a partial surface of the first layer;
a p-side electrode disposed on a surface of the second layer and electrically connected to the second layer;
an insulating film covering the p-side electrode;
an n-side electrode electrically connected to the first layer in the first area;
a reflection film disposed on the insulating film, extending to the n-side electrode, electrically connected to the n-side electrode, and made of a silver containing alloy or silver; and
a conductive layer which is formed on a surface of the reflection film, and which is made of a metal having a larger ionization tendency than an ionization tendency of the reflection film.
2. A semiconductor light emitting device according to claim 1 , wherein the p-side electrode transmits light having a luminescence wavelength of the luminous region.
3. A semiconductor light emitting device according to claim 1 , wherein the p-side electrode is made of a metal selected from a group consisting of Pt, Rh and Pd, and has a thickness of 1 nm to 15 nm.
4. A semiconductor light emitting device according to claim 1 , further comprising an intermediate layer disposed between the p-side electrode and the insulating film, the intermediate layer being made of at least a metal selected from a group consisting of Ti, Ni, W and Mo.
5. A semiconductor light emitting device according to claim 1 , wherein the p-side electrode transmits light having a luminescence wavelength of the luminous region.
6. A semiconductor light emitting device according to claim 1 , wherein the insulating film is made of at least a material selected from a group consisting of silicon oxide, titanium oxide, tantalum oxide, alumina, zirconium oxide, hafnium oxide, and insulating polymeric material.
7. A semiconductor light emitting device according to claim 1 , further comprising an insulating protective film covering the reflection film.
8. A semiconductor light emitting device according to claim 7 , wherein the protective film is made of at least a material selected from a group consisting of silicon oxide, titanium oxide, tantalum oxide, alumina, zirconium oxide, hafnium oxide, and insulating polymeric material.
9. A semiconductor light emitting device according to claim 7 , further comprising an intermediate layer disposed between the reflection film and the protective film, the intermediate layer being made of at least a metal selected from a group consisting of Ti, Ni, Al, W and Mo.
10. A semiconductor light emitting device according to claim 1 , further comprising:
a p-side pad for flip chip bonding disposed on a partial surface area of the p-side electrode; and
an n-side pad for flip chip bonding disposed on a partial surface area of the n-side electrode.
11. A semiconductor light emitting device according to claim 1 , further comprising:
a p-side pad for flip chip bonding disposed on a partial surface area of the p-side electrode; and
an n-side pad for flip chip bonding disposed on a surface of the reflection film superposing the second layer.
12. A semiconductor light emitting device according to claim 1 , wherein the reflection film has a plane shape which scatters light irradiated from the luminous region and propagating toward the reflection film, and the semiconductor light emitting device further comprises a fluorescent material member which produces fluorescence when light scattered by the reflection film becomes incident.
13. A semiconductor light emitting device comprising:
a luminous lamination structure including a first layer made of n-type nitride semiconductor and a second layer made of p-type nitride semiconductor and disposed over the first layer, wherein a luminous region is defined between the first and second layers and the second layer is removed to expose the first layer in a first area which is a partial surface of the first layer;
a p-side electrode disposed on a surface of the second layer, electrically connected to the second layer, and transmitting light irradiated from the luminous region;
an insulating film covering the p-side electrode;
an n-side electrode electrically connected to the first layer in the first area;
a reflection film disposed on the insulating film, extending to the n-side electrode, electrically connected to the n-side electrode, and which reflects light irradiated from the luminous region; and
a conductive layer which is formed on a surface of the reflection film, and which is made of a metal having a larger ionization tendency than an ionization tendency of the reflection film.
14. A semiconductor light emitting device according to claim 13 , wherein the p-side electrode is made of a metal selected from a group consisting of Pt, Rh and Pd, and has a thickness of 1 nm to 15 nm.
15. A semiconductor light emitting device comprising:
a luminous lamination structure including a first layer made of n-type nitride semiconductor and a second layer made of p-type nitride semiconductor and disposed over the first layer, wherein a luminous region is defined between the first and second layers and the second layer is removed to expose the first layer in a first area which is a partial surface of the first layer;
a p-side electrode disposed on a surface of the second layer and electrically connected to the second layer;
an insulating film covering the p-side electrode;
an n-side electrode electrically connected to the first layer in the first area;
a reflection film disposed on the insulating film, made of a silver containing alloy or silver, and made in an electrically floating state so as to be connected neither to the p-side electrode nor to the n-side electrode; and
a conductive layer which is formed on a surface of the reflection film, and which is made of a metal having a larger ionization tendency than an ionization tendency of the reflection film.
16. A semiconductor light emitting device according to claim 15 , wherein the p-side electrode transmits light having a luminescence wavelength of the luminous region.
17. A semiconductor light emitting device according to claim 15 , wherein the p-side electrode is made of a metal selected from a group consisting of Pt, Rh and Pd, and has a thickness of 1 nm to 15 nm.
18. A semiconductor light emitting device according to claim 15 , wherein the reflection film is disposed over the p-side electrode.
19. A semiconductor light emitting device comprising:
a luminous lamination structure including a first layer made of n-type nitride semiconductor and a second layer made of p-type nitride semiconductor and disposed over the first layer, wherein a luminous region is defined between the first and second layers and the second layer is removed to expose the first layer in a first area which is a partial surface of the first layer;
a p-side electrode disposed on a surface of the second layer, electrically connected to the second layer, and transmitting light irradiated from the luminous region;
an insulating film covering the p-side electrode;
an n-side electrode electrically connected to the first layer in the first area;
a reflection film disposed on the insulating film, made in an electrically floating state so as to be connected neither to the p-side electrode nor to the n-side electrode, and which reflects light irradiated from the luminous region; and
a conductive layer which is formed on a surface of the reflection film, and which is made of a metal having a larger ionization tendency than an ionization tendency of the reflection film.
20. A semiconductor light emitting device according to claim 19 , wherein the reflection film is disposed over the p-side electrode.