Environmental protection of serial ATA and other electronic devices
A system for communicating with an electronic device within a sealed vessel comprises a generally enclosed housing having an opening. A printed circuit board is provided for covering the housing opening to create a fully enclosed sealed vessel. An electronic device is located within the interior of the sealed vessel and an external device is located outside the sealed vessel. At least one conductive path comprised of at least one conductive trace and at least one conductive via extends through the printed circuit board from the first surface located on the outside of the sealed vessel to a second surface located on the inside of the sealed vessel. The conductive path has a first end on the first surface which is connected to the external device and a second end on the second surface which is connected to the electronic device. In this manner, a communication path is established between the external device and the electronic device within the interior of the sealed vessel utilizing the at least one conductive path.
1. A system for communicating with an electronic device within a sealed vessel comprising:
a generally enclosed housing having an opening;
a printed circuit board comprising at least two laminated substrate layers covering the housing opening to create a fully enclosed, sealed vessel;
an electronic device within the interior of the sealed vessel;
an external device outside of the sealed vessel; and
at least one conductive path extending through the printed circuit board from a first surface located outside of the sealed vessel to a second surface located inside of the sealed vessel, the at least one conductive path comprising at least five conductive elements, a first conductive trace element located on the first surface of the first layer of the printed circuit board, a first blind via connected to the first conductive trace element and extending through the first substrate layer of the printed circuit board, a second conductive trace element connected to the first blind via and extending between the first substrate layer of the printed circuit board and a second substrate layer of the printed circuit board, a second blind via connected to the second conductive trace element and extending through the second substrate layer of the printed circuit board, and a third conductive trace element connected to the second blind via and located on the second surface of the second substrate layer of the printed circuit board, the external device being connected to the first conductive trace element and the electronic device being connected to the third conductive trace element, whereby communication is established between the external device and the electronic device within the interior of the sealed vessel utilizing the at least one conductive path.
2. The system as recited in claim 1 , wherein the printed circuit board further comprises a series of conductive trace and via elements which extend on, through and between the layers of the printed circuit board to form a shield around at least a portion of the at least one conductive path.