Substrate holding apparatus

1. A substrate holding apparatus comprising:

a top ring configured to hold a substrate to be polished, and press the substrate against a polishing surface;

an air bag attached to said top ring so as to be brought into contact with a rear face of the substrate when held by said top ring;

a regulator operable to regulate a temperature control fluid to be supplied into said air bag;

a flow regulating valve operable to regulate a flow rate of the temperature control fluid when discharged from said air bag; and

a thermometer provided in said air bag to measure a temperature of the substrate when held by said top ring.

2. The substrate holding apparatus as recited in claims 1 , wherein said thermometer is to monitor the temperature of the substrate when held by said top ring, and the substrate is to be controlled in terms of its temperature based on the temperature as monitored by said thermometer.

3. The substrate holding apparatus as recited in claim 2 , wherein

the substrate is to be controlled in terms of its temperature, based on the temperature as monitored by said thermometer, by operating said flow regulating valve such that regulated is the flow rate of the temperature control fluid when discharged from said air bag.

4. The substrate holding apparatus as recited in claim 1 , wherein said air bag comprises a close-type air bag or an open-type air bag.

5. The substrate holding apparatus as recited in claim 1 , further comprising:

a supply passage for supplying the temperature control fluid into said air bag, said regulator being in said supply passage; and

a discharge passage for discharging the temperature control fluid from said air bag, said flow regulating valve being in said discharge passage.

6. The substrate holding apparatus as recited in claim 5 , wherein

said flow regulating valve is operable to regulate the flow rate of the temperature control fluid, when discharged from said air bag, so as to control a temperature of the substrate when held by said top ring and pressed against the polishing surface.

7. The substrate holding apparatus as recited in claim 1 , wherein

said flow regulating valve is operable to regulate the flow rate of the temperature control fluid, when discharged from said air bag, so as to control a temperature of the substrate when held by said top ring and pressed against the polishing surface.

8. A substrate holding apparatus comprising:

a top ring configured to hold a substrate to be polished, and press the substrate against a polishing surface;

an air bag attached to said top ring so as to be brought into contact with a rear face of the substrate when held by said top ring, said air bag including chambers;

regulators operable to regulate temperature control fluids to be supplied into said chambers, respectively;

flow regulating valves operable to regulate flow rates of the temperature control fluids, respectively, when discharged from said chambers; and

a thermometer provided in said air bag to measure a temperature of the substrate when held by said top ring.

9. The substrate holding apparatus as recited in claim 8 , wherein said thermometer is to monitor the temperature of the substrate when held by said top ring, and the substrate is to be controlled in terms of its temperature based on the temperature as monitored by said thermometer.

10. The substrate holding apparatus as recited in claim 9 , wherein

the substrate is to be controlled in terms of its temperature, based on the temperature as monitored by said thermometer, by operating said flow regulating valves such that regulated are the flow rates of the temperature control fluids when discharged from said chambers, respectively.

11. The substrate holding apparatus as recited in claim 8 , wherein said air bag comprises a close-type air bag or an open-type air bag.

12. The substrate holding apparatus as recited in claim 8 , wherein

said chambers include a chamber located above a central portion of the substrate and a chamber located above a peripheral portion of the substrate, when the substrate is held by said top ring.

13. The substrate holding apparatus as recited in claim 12 , wherein

said chamber located above the central portion of the substrate, when held by said top ring, is to be supplied with a temperature control fluid cooled more intensively than a temperature control fluid to be supplied into said chamber located above the peripheral portion of the substrate, when held by said top ring.

14. The substrate holding apparatus as recited in claim 8 , further comprising:

supply passages for supplying the temperature control fluids into said chambers, respectively, said regulators being in said supply passages, respectively; and

discharge passages for discharging the temperature control fluids from said chambers, respectively, said flow regulating valves being in said discharge passages, respectively.

15. The substrate holding apparatus as recited in claim 14 , wherein

said flow regulating valves are operable to regulate the flow rates of the temperature control fluids, when discharged from said chambers, respectively, so as to control a temperature of the substrate when held by said top ring and pressed against the polishing surface.

16. The substrate holding apparatus as recited in claim 8 , wherein

said chambers include chambers divided in a radial direction of the substrate when held by said top ring.

17. The substrate holding apparatus as recited in claim 8 , wherein

said chambers are to be supplied with temperature control fluids cooled independently of each other.

18. The substrate holding apparatus as recited in claim 8 , wherein

said flow regulating valves are operable to regulate the flow rates of the temperature control fluids when discharged from said chambers, respectively, so as to control a temperature of the substrate when held by said top ring and pressed against the polishing surface.