Microfabrication using patterned topography and self-assembled monolayers
A method of selectively and electrolessly depositing a metal onto a substrate having a metallic microstructured surface is disclosed. The method includes forming a self-assembled monolayer on the metallic microstructured surface, exposing the self-assembled monolayer to an electroless plating solution including a soluble form of a deposit metal, and depositing electrolessly the deposit metal selectively on the metallic microstructured surface. Articles formed from this method are also disclosed.
1. A method comprising:
forming a microstructure, with a mechanical tool, onto a substrate metallic surface, to form a metallic microstructured surface;
forming a self-assembled monolayer on the metallic microstructured surface;
exposing the self-assembled monolayer to an electroless plating solution comprising a soluble form of a deposit metal; and
depositing electrolessly the deposit metal selectively on the metallic microstructured surface.
2. A method according to claim 1 wherein the forming a microstructure step comprises embossing a microstructure, with a mechanical tool, onto a substrate metallic surface, to form a metallic microstructured surface.
3. A method according to claim 1 wherein the forming a microstructure step comprises scribing a microstructure, with a mechanical tool, onto a substrate metallic surface, to form a metallic microstructured surface.
4. A method according to claim 1 wherein the forming a microstructure step comprises molding a microstructure, with a mechanical tool, onto a substrate metallic surface, to form a metallic microstructured surface.
5. A method according to claim 1 wherein the metallic microstructured surface comprises a metal selected from the group consisting of gold, silver, palladium, platinum, rhodium, copper, nickel, iron, indium, tin, and mixtures, alloys, and compounds thereof.
6. A method according to claim 1 wherein the substrate comprises glass, ceramic, glass-ceramic, or semiconductor.
7. A method according to claim 1 wherein the self assembled monolayer comprises a chemical species selected from the group consisting of organosulfur compounds, silanes, phosphonic acids, benzotriazoles, and carboxylic acids.
8. A method according to claim 1 wherein the self assembled monolayer comprises an organosulfur compound selected from the group consisting of alkyl thiols, dialkyl disulfides, dialkyl thiocarbamates, and alkyl xanthates.
9. A method according to claim 1 wherein the metallic microstructure surface comprises a topographical feature having a radius of curvature of less than 0.5 micrometers.
10. A method according to claim 2 further comprising, after the depositing electrolessly the deposit metal selectively on the metallic microstructured surface step, removing at least a portion of the metal layer upon which deposit metal was not selectively deposited, to form a deposit metal pattern on the metallic microstructured surface.
11. A method according to claim 1 wherein the exposing step comprises exposing the self-assembled monolayer to an electroless plating solution comprising a soluble form of a deposit metal selected from the group consisting of copper, nickel, gold, silver, palladium, rhodium, ruthenium, tin, cobalt, and zinc.
12. A method comprising:
forming a microstructure, with a mechanical tool, onto a substrate surface, to form a substrate microstructured surface;
disposing a metal layer on the substrate microstructured surface to form a metallic microstructured surface;
forming a self-assembled monolayer on the metallic microstructured surface;
exposing the self-assembled monolayer to an electroless plating solution comprising a soluble form of a deposit metal; and
depositing electrolessly the deposit metal selectively on the metallic microstructured surface.
13. A method according to claim 12 wherein the forming a microstructure step comprises embossing a microstructure, with a mechanical tool, onto a substrate surface, to form a substrate microstructured surface.
14. A method according to claim 12 wherein the forming a microstructure step comprises scribing a microstructure, with a mechanical tool, onto a substrate surface, to form a substrate microstructured surface.
15. A method according to claim 12 wherein the forming a microstructure step comprises molding a microstructure, with a mechanical tool, onto a substrate surface, to form a substrate microstructured surface.
16. A method according to claim 12 , wherein the metallic microstructured surface comprises a metal selected from the group consisting of gold, silver, palladium, platinum, rhodium, copper, nickel, iron, indium, tin, and mixtures, alloys, and compounds thereof.
17. A method according to claim 12 wherein the exposing step comprises exposing the self-assembled monolayer to an electroless plating solution comprising a soluble form of a deposit metal selected from the group consisting of copper, nickel, gold, silver, palladium, rhodium, ruthenium, tin, cobalt, and zinc.
18. A method according to claim 12 wherein the substrate comprises glass, ceramic, glass-ceramic, or semiconductor.
19. A method according to claim 12 wherein the self assembled monolayer comprises a chemical species selected from the group consisting of organosulfur compounds, silanes, phosphonic acids, benzotriazoles, and carboxylic acids.
20. A method according to claim 2 wherein the self assembled monolayer comprises an organosulfur compound selected from the group consisting of alkyl thiols, dialkyl disulfides, dialkyl thiocarbamates, and alkyl xanthates.
21. A method according to claim 12 wherein the metallic microstructure surface comprises a topographical feature having a radius of curvature of less than 0.5 micrometers.
22. A method comprising:
providing a substrate having a metallic microstructured surface;
forming a self-assembled monolayer on the metallic microstructured surface;
exposing the self-assembled monolayer to an electroless plating solution comprising a soluble form of a deposit metal selected from the group consisting of copper, nickel, gold, silver, palladium, rhodium, ruthenium, tin, cobalt, and zinc; and
depositing electrolessly the deposit metal selectively on the metallic microstructured surface.
23. A method according to claim 22 , wherein the metallic microstructured surface comprises a metal selected from the group consisting of gold, silver, palladium, platinum, rhodium, copper, nickel, iron, indium, tin, and mixtures, alloys, and compounds thereof.
24. A method according to claim 22 wherein the substrate comprises glass, ceramic, glass-ceramic, or semiconductor.
25. A method according to claim 22 wherein the self assembled monolayer comprises a chemical species selected from the group consisting of organosulfur compounds, silanes, phosphonic acids, benzotriazoles, and carboxylic acids.
26. A method according to claim 22 wherein the self assembled monolayer comprises an organosulfur compound selected from the group consisting of alkyl thiols, dialkyl disulfides, dialkyl thiocarbamates, and alkyl xanthates.
27. A method according to claim 22 wherein the metallic microstructure surface comprises a topographical feature having a radius of curvature of less than 0.5 micrometers.
28. A method comprising:
providing a substrate comprising a polymeric material and having a metallic microstructured surface disposed on the substrate;
forming a self-assembled monolayer on the metallic microstructured surface;
exposing the self-assembled monolayer to an electroless plating solution comprising a soluble form of a deposit metal; and
depositing electrolessly the deposit metal selectively on the metallic microstructured surface.
29. A method according to claim 28 , wherein the metallic microstructured surface comprises a metal selected from the group consisting of gold, silver, palladium, platinum, rhodium, copper, nickel, iron, indium, tin, and mixtures, alloys, and compounds thereof.
30. A method according to claim 28 wherein the exposing step comprises exposing the self-assembled monolayer to an electroless plating solution comprising a soluble form of a deposit metal selected from the group consisting of copper, nickel, gold, silver, palladium, rhodium, ruthenium, tin, cobalt, and zinc.
31. A method according to claim 28 wherein the self assembled monolayer comprises a chemical species selected from the group consisting of organosulfur compounds, silanes, phosphonic acids, benzotriazoles, and carboxylic acids.
32. A method according to claim 28 wherein the self assembled monolayer comprises an organosulfur compound selected from the group consisting of alkyl thiols, dialkyl disulfides, dialkyl thiocarbamates, and alkyl xanthates.
33. A method according to claim 28 wherein the metallic microstructure surface comprises a topographical feature having a radius of curvature of less than 0.5 micrometers.