IP Library › Granted Patent US 7,170,384
Granted Patent B2
US 7,170,384 · App. 11/140,680 · Granted Jan 30, 2007

Printed circuit board having three-dimensional spiral inductor and method of fabricating same

Assignee: Samsung Electro-Mechanics Co., Ltd.
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Quick Facts
Patent No.
US 7,170,384
App. No.
11/140,680
Granted
Jan 30, 2007
Kind
B2
Abstract

A printed circuit board (PCB) having a three-dimensional spiral inductor, which includes a plurality of insulating layers and conductor layers. The PCB comprises a plurality of coil conductor patterns made of conductive material and shaped into strips, which is provided on the plurality of conductor layers, respectively, such that the plurality of coil conductor patterns are parallel to each other and positioned on the same plane perpendicular to the conductor layers, and in which each of the plurality of coil conductor patterns is longer than an adjacent inner coil conductor pattern.

Claims (11)

1. A printed circuit board having a three-dimensional spiral inductor, comprising:

a plurality of coil conductor patterns provided on a plurality of conductor layers such that the plurality of coil conductor patterns are parallel to each other and positioned on a plane perpendicular to the conductor layers, and;

a plurality of conductive through holes electrically connecting the coil conductor patterns such that the plurality of coil conductor patterns and the plurality of conductive through holes form a spiral conductor all together, and wherein the plurality of coil conductor patterns are longer than an adjacent inner coil conductor pattern of the spiral conductor; and

a pair of lead out patterns connected to an inner end and an outer end of the spiral conductor to allow external power to be supplied to the spiral conductor.

2. The printed circuit board as set forth in claim 1 , wherein the plurality of conductive through holes is filled with a conductive material.

3. The printed circuit board as set forth in claim 1 , wherein plating layers are formed on walls of the plurality of conductive through holes.

4. The printed circuit board as set forth in claim 1 , wherein each of the coil conductor patterns is wider than the adjacent inner coil conductor pattern.

5. The printed circuit board as set forth in claim 1 , wherein the printed circuit board has a plurality of three-dimensional spiral inductors, each three-dimensional spiral inductor adjacently positioned and spirally extended in opposite directions and wherein the plurality of conductive through holes are provided on each of the three-dimensional spiral inductors to electrically connect them.

6. The printed circuit board as set forth in claim 1 , wherein the spiral inductors positioned on two adjacent planes are spirally extended in opposite directions.

7. The printed circuit board as set forth in claim 5 , wherein the plurality of three-dimensional spiral inductors adjacently positioned are spirally extended in the same direction.

8. The printed circuit board as set forth in claim 1 , wherein the printed circuit board having a three-dimensional spiral inductor further comprises a plurality of insulating layers adjacent the plurality of conductor layers.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2005
From: KIM, HAN; MIN, BYOUNG Y.; KIM, YOUNG W.; LEE, YOUNG J.; RYU, CHANG M.
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 016642/0486 →
Priority Claims (1)
KR 10-2004-0116806 · Dec 30, 2004 · national
Continuity (1)
Related Publication 20060145805A1 · Jul 6, 2006