Method of depositing patterned films of materials using a positive imaging process

1. A method for forming a pattern on a substrate, comprising:

applying a precursor comprising at least one metal to a substrate to form a precursor layer;

exposing a predetermined portion of the precursor layer; and

developing the predetermined portion of the precursor layer, thereby at least substantially removing the predetermined portion from the substrate and forming a pattern on the substrate comprising a remaining portion of the precursor.

2. The method of claim 1 , wherein the precursor comprises a molecular precursor.

3. The method of claim 1 , wherein the precursor comprises particles chemically bound to at least one ligand.

4. The method of claim 1 , wherein the precursor comprises Ti(Pr i O) 2 (EAA) 2 .

5. The method of claim 1 , wherein said exposing comprises photochemically reacting, photothermally reacting and combinations thereof.

6. The method of claim 1 , wherein said exposing comprises radiating the predetermined portion of the precursor layer with electromagnetic radiation.

7. The method of claim 1 , wherein the electromagnetic radiation comprises ultraviolet radiation.

8. The method of claim 1 , wherein said developing comprises contacting the first predetermined portion with a polar solvent.

9. The method of claim 1 , wherein said developing comprises contacting the first predetermined portion with a protic solvent.

10. The method of claim 1 further comprising:

exposing a second predetermined portion of the precursor layer; and

developing the second predetermined portion of the precursor layer, thereby at least substantially removing the second predetermined portion from the substrate and forming a second pattern on the substrate comprising a second remaining portion of the precursor.

11. The method of claim 1 , further comprising pre-exposing the precursor layer to energy before said exposing.

12. The method of claim 1 further comprising post-exposing the precursor to energy after said exposing step. to energy before said exposing.

13. The method of claim 2 , wherein the precursor further comprises particles chemically bound to least one ligand.

14. The method of claim 3 , wherein the particles comprise sol particles.

15. The method of claim 3 , wherein the particles comprise microparticles.

16. The method of claim 3 , wherein the particles comprise nanoparticles.

17. The method of claim 3 , wherein the particles comprise ceramics.

18. The method of claim 3 , wherein the particles comprise alloys.

19. The method of claim 14 , further comprising transforming the precursor into a gel.

20. The method of claim 11 , wherein said pre-exposing comprises photochemically reacting, photothermally reacting and combinations thereof.

21. The method of claim 11 , wherein the pre-exposing comprises radiating the predetermined portion of the precursor layer with electromagnetic radiation.

22. The method of claim 11 , wherein the electromagnetic radiation comprises ultraviolet radiation.

23. The method of claim 11 , wherein the pre-exposing further comprises selecting a predetermined fraction of a minimum energy necessary for developing the predetermined portion of the precursor.

24. The method of claim 11 , further comprising post-exposing the precursor to energy after said exposing step.

25. The method of claims 24 or 12 , wherein said post-exposing comprises photochemically reacting, photothermally reacting and combinations thereof.

26. The method of claims 24 or 12 , wherein the post-exposing comprises radiating the predetermined portion of the precursor layer with electromagnetic radiation.

27. The method of claim 24 or 12 , wherein the electromagnetic radiation comprises ultraviolet radiation.

28. An electronic component formed by a process comprising:

applying a precursor comprising at least one metal to a substrate to form a precursor layer;

exposing a predetermined portion of the precursor layer; and

developing the predetermined portion of the precursor layer, thereby at least substantially removing the predetermined portion from the substrate and forming a pattern on the substrate comprising a remaining portion of the precursor.

29. The electronic component of claim 28 , wherein the precursor comprises a molecular precursor.

30. The electronic component of claim 28 , wherein the precursor comprises particles chemically bound to at least one ligand.

31. The electronic component of claim 28 , wherein the process further comprises pre-exposing the precursor to energy before said exposing.

32. The electronic component of claim 28 , wherein the process further comprises post-exposing the precursor to energy after said exposing.

33. The method of claim 29 , wherein the precursor further comprises particles chemically bound to least one ligand.

34. The electronic component of claim 30 , wherein the particles comprise sol particles.

35. The electronic component of claim 30 , wherein the particles comprise microparticles.

36. The electronic component of claim 30 , wherein the particles comprise nanoparticles.

37. The electronic component of claim 30 , wherein the particles comprise ceramics.

38. The electronic component of claim 30 , wherein said particles comprise alloys.

39. The electronic component of claim 34 , further comprising transforming the precursor into a gel.

40. The electronic component of claim 31 , wherein the process further comprises post-exposing the precursor to energy after said exposing.

41. A precursor comprising:

a metal-containing material comprising Ti(Pr i O) 2 (EAA) 2 or any isomer thereof; and

a casting solvent.

42. A film of material comprising Ti(Pr i O) 2 (EAA) 2 or any isomer thereof.

43. An electronic component comprising:

a substrate; and

a metal-containing material comprising Ti(Pr i O) 2 (EAA) 2 or an isomer thereof applied to said substrate.