Semiconductor device having resin anti-bleed feature
A device and a method for controlling resin bleed, the device comprising a substrate having a surface, wherein an interior region, a peripheral region, and an exterior region of the surface are generally defined. An adhesive generally resides on the surface of the substrate in the peripheral region thereof, wherein the adhesive comprises a plurality of components, such as a metal and a resin. A first barrier is formed on the surface of the substrate generally between the adhesive and the exterior region, wherein the first barrier generally prevents one or more of the plurality of components of the adhesive from bleeding onto the exterior region of the surface of the substrate.
1. A device for controlling resin bleed in an integrated circuit package, the device comprising:
a substrate having a surface, wherein an interior region, a peripheral region, and an exterior region of the surface are generally defined;
an integrated circuit associated with the interior region of the surface of the substrate;
an adhesive comprising a plurality of components, wherein the adhesive generally resides on the surface of the substrate in the peripheral region thereof, and wherein the adhesive is operable to substantially bond a cap to the substrate; and
a first barrier formed over the surface of the substrate, wherein the first barrier generally resides between the adhesive and the exterior region, and wherein the first barrier generally prevents one or more of the plurality of components associated with the adhesive from bleeding onto the exterior region of the surface of the substrate.
2. The device of claim 1 , wherein a surface of the first barrier has a porosity that is less than a porosity of one or more of the interior region and the exterior region.
3. The device of claim 2 , wherein the first barrier is comprised of a material having a porosity that is less than a porosity of the substrate.
4. The device of claim 3 , wherein the material is comprised of one or more of a metal and a metal alloy.
5. The device of claim 4 , wherein the metal comprises one or more gold, silver, nickel, copper, and titanium.
6. The device of claim 4 , wherein the material is electroplated onto the surface of the substrate.
7. The device of claim 4 , wherein the material is silk-screened onto the surface of the substrate.
8. The device of claim 3 , wherein the first barrier provides an electrical connection to an electrical ground.
9. The device of claim 1 , wherein the first barrier has a thickness extending in a direction generally perpendicular to the surface of the substrate, wherein the thickness is less than approximately one micron.
10. The device of claim 1 , further comprising a second barrier formed on the surface within one or more of the interior region and peripheral region, wherein the resin is generally contained between the first barrier and the second barrier.
11. The device of claim 10 , wherein the first barrier and the second barrier are comprised of the same material.
12. The device of claim 1 , wherein the first barrier comprises a ring, wherein an interior portion of the ring encompasses the interior region of the substrate.
13. The device of claim 1 , wherein the cap generally surrounds the integrated circuit, therein generally protecting the integrated circuit from an external environment.
14. The device of claim 1 , wherein the first barrier is formed near an edge of the substrate.
15. The device of claim 1 , wherein at least one of the one or more components comprises a resin.
16. The device of claim 1 , wherein the substrate is comprised of a ceramic.