Semiconductor device and manufacturing process thereof
One of the aspects of the present invention is to provide a semiconductor device, which includes a circuit board, a first semiconductor chip mounted on the circuit board, a built-in semiconductor package on the first semiconductor chip, and a first molded resin encompassing the first semiconductor chip and the built-in semiconductor package. The built-in semiconductor package includes at least one second semiconductor chip mounted on a die pad, and the second semiconductor chip has a plurality of terminals. Also, the built-in semiconductor package includes a plurality of lead frames, and each of the lead frames is electrically connected with respective one of the terminals of the second semiconductor chip, and has a connection region on one side and a support region on the other opposing side. Further, the built-in semiconductor package a second molded resin encompassing the die pad, the second semiconductor chip, and the lead frames so that each of the connection regions is exposed and each of the support regions is covered. While the second molded resin has top and bottom surfaces, a plane flush with the connection region locates between the top and bottom surfaces of the second molded resin.
1. A semiconductor device, comprising:
a circuit board;
a first semiconductor chip mounted on said circuit board;
a built-in semiconductor package on said first semiconductor chip; and
a first molded resin encompassing said first semiconductor chip and said built-in semiconductor package;
said built-in semiconductor package including,
at least one second semiconductor chip mounted on a die pad, said second semiconductor chip having a plurality of terminals,
a plurality of lead frames, each of said lead frames being electrically connected with respective one of the terminals of said second semiconductor chip and having a connection region on one side and a support region on the other opposing side, and
a second molded resin encompassing said die pad, said second semiconductor chip, and said lead frames so that each of the connection regions is exposed and each of the support regions is covered, said second molded resin having top and bottom surfaces,
wherein a plane flush with the connection region is located between the top and bottom surfaces of said second molded resin.
2. The semiconductor device according to claim 1 ,
wherein each of said lead frames is electrically connected with respective one of the terminals of said second semiconductor chip via a conductive wire.
3. The semiconductor device according to claim 1 ,
wherein said first semiconductor chip is electrically connected with said circuit board via at least one conductive wire.
4. The semiconductor device according to claim 1 ,
wherein said first semiconductor chip is electrically connected with said circuit board via at least one conductive bump between said first semiconductor chip and said circuit board.
5. The semiconductor device according to claim 1 ,
wherein the die pad of said built-in semiconductor package includes upper and lower surfaces, and said second semiconductor chip being mounted on at least either one of the upper and lower surfaces of the die pad.
6. The semiconductor device according to claim 1 ,
wherein said built-in semiconductor package includes at least one third semiconductor chip mounted on said second semiconductor chip.
7. The semiconductor device according to claim 1 ,
wherein said built-in semiconductor package includes a planar shape having two pairs of opposing members, and said lead frames extending from at least either one of pair of the opposing members.
8. A manufacturing process of a semiconductor device, comprising:
mounting a first semiconductor chip on a circuit board;
mounting at least one second semiconductor chip on a die pad, said second semiconductor chip having a plurality of terminals;
electrically connecting each one of a plurality of lead frames with respective one of the terminals of said second semiconductor chip, each of said lead frames having a connection region on one side and a support region on the other opposing side; and
molding a resin to form a built-in semiconductor package having top and bottom surfaces, said built-in semiconductor package encompassing said die pad, said second semiconductor chip, and said lead frames, so that each of the connection regions is exposed, each of the support regions is covered, and a plane flush with the connection region located between the top and bottom surfaces of said built-in semiconductor package;
mounting said built-in semiconductor package on said first semiconductor chip;
electrically connecting each of the connection regions of said lead frames with said circuit board;
molding a resin encompassing said first semiconductor chip and said resin package.
9. A built-in semiconductor package to be built in a semiconductor device, the built-in semiconductor package comprising:
at least one semiconductor chip mounted on a die pad, said semiconductor chip having a plurality of terminals;
a plurality of lead frames, each of said lead frames being electrically connected with respective one of the terminals of said semiconductor chip and having a connection region on one side and a support region on the other opposing side, and
a molded resin encompassing said die pad, said semiconductor chip, and said lead frames so that each of the connection regions is exposed and each of the support regions is covered, said molded resin having top and bottom surfaces;
wherein a plane flush with the connection region is located between the top and bottom surfaces of said molded resin.