Method for manufacturing compound semiconductor wafer and compound semiconductor device
View Patent ↗A method for producing a compound semiconductor wafer used for production of HBT by vapor growth of a sub-collector layer, a collector layer, a base layer and an emitter layer in this turn on a compound semiconductor substrate using MOCVD method wherein the base layer is grown as a p-type compound semiconductor thin film layer containing at least one of Ga, Al and In as a Group III element and As as a Group V element under such growth conditions that the growth rate gives a growth determined by a Group V gas flow rate-feed.
1. A method for producing a compound semiconductor wafer used for production of HBT by vapor growth of a sub-collector layer, a collector layer, a base layer and an emitter layer in this order on a compound semiconductor substrate using MOCVD method wherein the base layer is a p-type compound semiconductor thin film layer containing at least one of Ga, Al and In as a Group III element and As as a Group V element and is grown under such conditions that the growth rate gives a growth determined by a Group V gas flow rate-feed, wherein the adjustment of carrier concentration in the base layer is controlled by the flow rate of methane halide.
2. A method according to claim 1 , wherein the base layer is grown with the V/III ratio being within the range of 0.3–1.0.
3. A method according to claim 1 or 2 , wherein the adjustment of carrier concentration in the base layer is controlled by the flow rate of CBrCl 3 .
4. A method according to claim 1 , wherein the base layer is grown with the V/III ratio being within the range of 0.7–1.0.