Method of manufacturing electronic device
Disclosed is a method of manufacturing an electronic device, comprising forming a concave portion on the surface of a base member, forming an electrically conductive seed layer on that surface of the base member on which a plated film is to be formed, and applying an electrolytic plating treatment with the seed layer used as a common electrode under the condition that a substance for accelerating the electrolytic plating is allowed to be present in the concave portion of the base member in an amount larger than that on the surface of the base member to form a plated film.
1. A method of manufacturing an electronic device, comprising:
forming a concave portion on the surface of a base member;
forming an electrically conductive seed layer on that surface of the base member on which a plated film is to be formed; and
applying an electrolytic plating treatment with the seed layer used as a common electrode under the condition that a layer of a substance for inhibiting electrolytic plating is formed on the surface of the base member except the concave portion to form a plated film,
wherein the layer of the substance for inhibiting the electrolytic plating is formed by forming a film having a directivity, with the base member held inclined in the film-forming direction.
2. A method of manufacturing an electronic device according to claim 1 , wherein the substance for inhibiting the electrolytic plating is an insulating material.
3. A method of manufacturing an electronic device according to claim 1 , further comprising subjecting the plated film to a chemical mechanical polishing treatment so as to form a buried wiring in the concave portion of the base member.