Curing agent composition for epoxy resin
An epoxy resin curing agent composition containing a ketimine compound prepared by the reaction between a polyoxypropylenediamine component and a ketone compound, wherein (1) the polyoxypropylenediamine component is a 9/1 to 6/4 (by weight) mixture of polyoxypropylenediamine having a molecular weight of 200 and 500 and polyoxypropylenediamine having a molecular weight of 1000 to 3000, (2) the ketimine compound has a degree of ketimination of 90% or higher, or (3) the reaction is carried out in the presence of a catalyst selected from (i) a combination of a tertiary amine and a sulfonic acid and (ii) a salt between a tertiary amine and a sulfonic acid.
1. An epoxy resin curing agent composition containing a ketimine compound prepared by the reaction between a polyoxypropylenediamine component and a ketone compound, the polyoxypropylenediamine component being a mixture comprising polyoxypropylenediamine having a Mw of 200 to 500 and polyoxypropylenediamine having a Mw of 1000 to 3000 at a weight ratio of 9/1 to 6/4.
2. The epoxy resin curing agent composition according to claim 1 , wherein the ketone compound is methyl isobutyl ketone.
3. The epoxy resin curing agent composition according to claim 1 , wherein the ketimine compound has a degree of ketimination of 90% or higher.
4. The epoxy resin curing agent composition according to claim 1 , wherein the reaction is carried out in the presence of a catalyst selected from the group consisting of a combination of a tertiary amine and a sulfonic acid and a salt between a tertiary amine and a sulfonic acid.
5. The epoxy resin curing agent composition according to claim 4 , wherein the catalyst is a triethylamine salt of p-toluenesulfonic acid.
6. A one-component curable epoxy resin composition comprising a polyepoxy compound and the epoxy resin curing agent composition according to claim 1 .
7. The one-component curable epoxy resin composition according to claim 6 , which is useful for coating applications.