Polishing apparatus having a trough
Methods and apparatus for chemical mechanical polishing are described. In one embodiment, an apparatus includes a table top and a transfer station and multiple polishing stations are mounted on the table top. The apparatus further includes multiple washing stations, where each washing station is located between either two polishing stations or between a polishing station and a transfer station. Multiple carrier heads are supported by a support member that is rotatable about an axis. The transfer station and the multiple polishing stations are arranged at approximately equal angular intervals about the axis.
1. A polishing apparatus comprising:
a platen configured to rotate relative to a table top about a central axis of the platen and within an annular fence;
a table top;
a bearing positioned between the table top and a lower surface of the platen; and
an annular fence attached to the table top and forming a trough between an outer surface of the platen, an inner surface of the annular fence and an upper surface of the table top;
wherein the trough includes sidewalls and a floor and the sidewalls are formed by the outer surface of the platen and the inner surface of the annular fence and the floor is formed by the upper surface of the table top.
2. The polishing apparatus of claim 1 , wherein the platen includes a platen top and a platen base aft ached to a lower surface of the platen top.
3. The apparatus of claim 1 , further comprising:
a drainpipe attached to the table top and in fluid communication with the trough; and
wherein the trough is configured to direct fluid toward the drainpipe during a polishing operation.
4. The apparatus of claim 1 , wherein the platen has a substantially circular cross-section.
5. The apparatus of claim 1 , where a portion of the table top extends beneath at least a portion of the platen.