Polyimide metal laminate

1. A polyimide metal laminate prepared by applying polyimide resin onto a metal foil and/or laminating polyimide film and a metal foil, said polyimide metal laminate comprising at least one resin layer produced from a silica-dispersed polyimide composition wherein the maximum size of the dispersed silica particles is less than 100 nm and the content of silica (SiO 2 ) in the silica-dispersed polyimide composition in the polyimide metal laminate is 1 to 50 parts by weight relative to 100 parts by weight of the polyimide and wherein the at least one resin layer is obtained by reacting (A) alkoxysilane and/or its partial hydrolysis polycondensate with (B) an amino-containing compound having a functional group capable of forming a bond with silica, in the presence of water in a polyimide solution and/or a polyamic acid solution wherein the storage elastic modulus E′ at temperature of 250 to 500° C. of the polyimide metal laminate is 0.3 to 30 GPa.

2. The polyimide metal laminate according to claim 1 , wherein the polyimide solution and/or the polyamic acid solution is a solution containing a polyimide copolymer and/or a polyamic acid copolymer synthesized from two or more diamine compounds and one or more tetracarboxylic dianhydrides.

3. The polyimide metal laminate according to claim 1 , which comprises polyimide or polyamic acid produced by using, as at least one of the diamine compounds, a compound represented by the following formula (1):

wherein X 1 and X 2 are independently selected from the group consisting of a single bond, an oxygen atom, a sulfur atom, a carbonyl group, a sulfonyl group, or a hydrocarbon group which may be substituted with a halogen atom, each Y independently presents selected from the group consisting of a hydrogen atom, a halogen atom, a hydroxyl group, an alkoxy group, a nitro group, and a hydrocarbon group which may be substituted with a halogen atom, and n is an integer of 0 to 8.

4. The polyimide metal laminate according to claim 1 , wherein a polyimide film prepared from the polyimide solution and/or polyamic acid solution has a linear expansion coefficient of 1×10 −6 to 70×10 −6/° C.

5. The polyimide metal laminate according to claim 1 , wherein the functional group capable of forming a bond with silica is an alkoxysilyl group.

6. The polyimide metal laminate according to claim 1 , wherein the silica-dispersed polyimide composition is represented by the following formula (2):

wherein W is a tetravalent organic group, Z and R2 independently represent a divalent organic group, R1 represents a hydrogen atom, a hydrocarbon group or an aromatic group, Q is a functional group capable of bonding to silica, m is a rational number of 0.001 to 0.5.