IP Library Granted Patent US 7,243,703
Granted Patent B2
US 7,243,703 · App. 10/628,240 · Granted Jul 17, 2007

Flexible heat exchanger

Assignee: Ube Industries, Ltd.
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Quick Facts
Patent No.
US 7,243,703
App. No.
10/628,240
Granted
Jul 17, 2007
Kind
B2
Abstract

The invention generally relates to a flexible heal exchanger comprising a pair of flexible multilayer thermoplastic polyimide films each of which comprises an aromatic polyimide substrate film showing no glass transition temperature or a glass transition temperature of 340° C. or higher and a thermoplastic aromatic polyimide surface film showing a glass transition temperature in the range of 190 to 300° C. in which the surface films of the flexible multilayer thermoplastic polyimide films face each other and are in part fused together, whereby producing between the flexible multilayer thermoplastic polyimide films a conduit pattern through which a fluid passes. The flexible multilayer thermoplastic polyimide films preferably have a thickness in the range of 10 to 125 μm and comprise a linear expansion coefficient of MD, a linear expansion coefficient of TD and an average of linear expansion coefficients of MD and TD, in the range of 10×10 −6 to 35×10 −6 cm/cm/° C. at 50-200° C.

Claims (6)

1. A flexible heat exchanger comprising a pair of flexible multilayer thermoplastic polyimide films each of which comprises an aromatic polyimide substrate film showing no glass transition temperature or a glass transition temperature of 340° C. or higher and a thermoplastic aromatic polyimide surface film showing a glass transition temperature in the range of 190 to 300° C. in which the surface films of the flexible multilayer thermoplastic polyimide films face each other and are in part fused together, whereby producing between the flexible multilayer thermoplastic polyimide films a conduit pattern through which a fluid passes,

wherein said flexible multilayer thermoplastic polyimide films have a thickness in the range of 10 to 125 μm and comprises a linear expansion coefficient of MD, a linear expansion coefficient of TD and an average of linear expansion coefficients of MD and TD, in the range of 10×10 −6 to 35×10 −6 cm/cm/° C. at 50-200° C.

2. The flexible heat exchanger of claim 1 , further comprising a heat conductive film on a surface thereof.

3. The flexible heat exchanger of claim 2 , wherein a flexible film having a heat radiant metal layer on one side is fixed to the heat conductive film.

4. The flexible heat exchanger of claim 3 , which has a heat resistant porous film on a surface having no heat conductive film thereon.

5. A space vehicle having the flexible heat exchanger of claim 1 on a surface thereof, in which the flexible heat exchanger comprises a pair of flexible multilayer thermoplastic polyimide films each of which comprises an aromatic polyimide substrate film showing no glass transition temperature or a glass transition temperature of 340° C. or higher and a thermoplastic aromatic polyimide surface film showing a glass transition temperature in the range of 190 to 300° C. in which the surface films of the flexible multilayer thermoplastic polyimide films face each other and are in part fused together, whereby producing between the flexible multilayer thermoplastic polyimide films a conduit pattern through which a fluid passes, wherein said flexible multilayer thermoplastic polyimide films have a thickness in the range of 10 to 125 μm and comprises a linear expansion coefficient of MD, a linear expansion coefficient of TD and an average of linear expansion coefficients of MD and TD, in the range of 10×10 −6 to 35×10 −6 cm/cm/° C. at 50-200° C.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2003
From: YAMAGUCHI, KOUJI; SATO, RYOICHI; OZAWA, HIDEKI
To: UBE INDUSTRIES, LTD.
Reel/Frame 014339/0988 →
Priority Claims (1)
JP 2002-219429 · Jul 29, 2002 · national
Continuity (1)
Related Publication 20040050532A1 · Mar 18, 2004