Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test

1. A method of testing, comprising:

(a) electrically connecting chip pads on top surfaces of each integrated circuit chip of a multiplicity of integrated circuit chips to module pads on top surfaces of respective modules of a multiplicity of modules;

after step (a), (b) dispensing a predetermined volume of polyalphaolefine oil on bottom surfaces of each integrated circuit chip of said multiplicity of integrated circuit chips;

after step (b), (c) electrically connecting socket pads on bottom surfaces of each module of said multiplicity of modules to a respective socket electrically connected to a circuit board;

after step (c), (d) placing said circuit board into an oven at a temperature above room temperature;

after step (d), (e) pressing front surfaces of a multiplicity of heat sinks to bottom surfaces of respective integrated circuit chips of said multiplicity of integrated circuit chips, said pressing causing said volume of polyalphaolefine oil to form a heat transfer layer between bottom surfaces of said multiplicity of integrated circuit chip and front surfaces of said multiplicity of heat sinks, said multiplicity of heat sinks mounted to a rack in said oven;

after step (e), (f) electrically testing said chips at a test temperature above room temperature, said liquid heat transfer layer being non-volatile and thermally stable at said test temperature;

after step (f), (g) removing said heat sinks from contact with said heat transfer layer;

after step (g), (h) removing said circuit board from said oven;

after step (h), (i) removing said multiplicity of modules from said multiplicity of sockets; and

after step (i), (h) removing any heat transfer layer remaining on said multiplicity of integrated circuits.

2. The method of claim 1 , wherein said chip pads include signal and power pads.

3. The method of claim 1 , wherein step (d) includes connecting said circuit board to a tester.

4. The method of claim 1 , wherein said test temperature is about 80° C. or higher.

5. The method of claim 1 , wherein said test temperature is about 140° C. or higher.

6. The method of claim 1 , wherein said polyalphaolefine oil comprises hydrogenated 1-decence homopolymer.

7. The method of claim 1 , further including:

individually controlling the circulation of a fluid through each heat sink of said multiplicity of heat sinks in order to control a temperature of respective integrated circuits of said multiplicity of integrated circuits.

8. The method of claim 1 , wherein step (i) includes rinsing said electronic device in an organic solvent.

9. The method of claim 1 , wherein, after step (f), a portion of said heat transfer layer remains on said heat sink.

10. The method of claim 1 , further including:

after step (i), repeating steps (a) through (i) with an additional multiplicity integrated circuit chips.

11. The method of claim 10 , wherein

a volume of said polyalphaolefine oil dispensed in step (b) for each additional integrated circuit chip of said additional multiplicity of integrated circuit chips is an additional predetermined volume less than said predetermined volume.

12. The method of claim 1 , further including:

after step (i), removing any heat transfer layer remaining on said top surface of each heat sink of said multiplicity of heat sinks.

13. The method of claim 1 , wherein step (b) includes:

dispensing said polyalphaolefine oil in a serpentine pattern, a star patter or a set of parallel bars on order that said heat transfer layer in order to prevent spillage of said polyalphaolefine oil onto said multiplicity of modules and multiplicity of sockets.

14. The method of claim 1 , wherein said polyalphaolefine oil has a vaporization temperature about 20° C. above said test temperature.

15. The method of claim 1 , wherein said heat transfer layer has a thickness between about 0 microns and about 3 microns and said heat transfer layer completely fills a gap between said top surfaces of each heat sink of said multiplicity of heat sink and said top surfaces of each integrated circuit chip of said multiplicity of integrated circuit chips.

16. The method of claim 1 , wherein in step (e) no portion of said polyalphaolefine oil spills over sides of any heat sink of said multiplicity of heat sink or sides of any module of said multiplicity of modules.

17. The method of claim 1 wherein said polyalphaolefine oil is electrically non-conductive.