Container assembly for laser diode module
In a container assembly for a laser diode module in which a temperature control device is not incorporated in advance, a heat-insulative casing is adapted to accommodate the laser diode module. A temperature detector is accommodated in the casing. A thermal coupling member is accommodated in the casing so as to thermally couple the laser diode module and the temperature detector. A heat-conductive plate member is attached to the casing. A heat transfer element is interposed between the thermal coupling member and the plate member so as to allow heat transfer therebetween. A sealing member is disposed between the casing and the plate member so as to seal the heat transfer element. A heat transfer controller causes the heat transfer element to control the heat transfer in accordance with a temperature of the thermal coupling member which is detected by the temperature detector.
1. A container assembly for a laser diode module in which a temperature control device is not incorporated in advance, comprising:
a heat-insulative casing, adapted to accommodate the laser diode module;
a temperature detector, accommodated in the casing;
a thermal coupling member, accommodated in the casing so as to thermally couple the laser diode module and the temperature detector;
a heat-conductive plate member, attached to the casing;
a heat transfer element, interposed between the thermal coupling member and the plate member so as to allow heat transfer therebetween;
a sealing member, disposed between the casing and the plate member so as to seal the heat transfer element;
a heat transfer controller, causing the heat transfer element to control the heat transfer in accordance with a temperature of the thermal coupling member which is detected by the temperature detector; and
an optical fiber, adapted to lead light emitted from the laser diode module; and
a board, on which the laser diode module is mounted,
wherein the casing is formed with a first opening closed by the optical fiber, a second opening closed by the board, and a third opening adapted to receive the heat transfer element and closed by the sealing member and the plate member.
2. The container assembly as set forth in claim 1 , wherein:
the temperature detector is a thermistor configured to vary a resistance value thereof in accordance with the temperature of the thermal coupling member;
the heat transfer element is a Peltier element operable to change a direction of the heat transfer in accordance with a current inputted thereto; and
the heat transfer controller controls the current so as to keep the resistance value constant.
3. The container assembly as set forth in claim 1 , wherein a gap between the optical fiber and the first opening is filled with an adhesive.
4. The container assembly as set forth in claim 1 , wherein a gap between the board and the second opening is filled with an adhesive.
5. The container assembly as set forth in claim 1 , wherein at least a part of the heat-insulative casing is plated with a metal.
6. The container assembly as set forth in claim 5 , wherein the at least the part of the heat-insulative casing which is plated with the metal is grounded.