Heat dissipation device

1. A heat dissipation device for a heat-generating electronic component, comprising:

a heat spreader having a bottom surface adapted for thermally contacting the electronic component and a top surface opposite to the bottom surface;

a conducting member thermally coupled with the top surface of the heat spreader, with a plurality of first fins extending downwardly from a top of the conducting member, pointed toward a base of the conducting member and spaced from the base a distance, a plurality of first passages formed between the first fins and extending along a front-to-back direction, the conducting member comprising an upper base plate at the top, a lower base plate at the base and spaced from the upper base plate a distance, and a connecting portion interconnecting the upper base plate and the lower base plate;

a plurality of second fins extending upwardly from the top of the conducting member, a plurality of second passages formed between the second fins and extending along the front-to-back direction;

a fan mounted on a back side of the first and second fins, the fan providing airflow to the first and second fins along the front-to-back direction; and

a heat pipe thermally connecting the heat spreader with the conducting member and the second fins, the heat pipe comprising an evaporating portion sandwiched between the heat spreader and the lower base plate and a condensing portion sandwiched between the upper base plate and the second fins, wherein the evaporating portion and the condensing portion of the heat pipe are parallel to each other and extend along a lateral direction perpendicular to the front-to-back direction.

2. The heat dissipation device as described in claim 1 , wherein the upper base plate is longer than the lower base plate.

3. The heat dissipation device as described in claim 2 , wherein the upper and lower base plates and the first fins are integrally fabricated by metal extrusion.

4. The heat dissipation device as described in claim 1 , where the connecting portion interconnects middle portions of the upper and lower base plates.

5. The heat dissipation device as described in claim 1 , wherein the connecting portion divides the first fins into two groups, and the two groups of the first fins locate at opposite two sides of the connecting portion, respectively.

6. The heat dissipation device as described in claim 1 , wherein the first and the second fins are perpendicular to the heat spreader.

7. A heat dissipation device comprising:

a heat spreader;

a conducting member mounted on the heat spreader, and comprising an upper base plate having a plurality of first fins perpendicularly extending therefrom, a lower base plate parallel to the upper base plate and a connecting portion interconnecting the upper base plate and the lower base plate, wherein the first fins extends from the upper base plate toward the lower base plate; and

a first heat pipe thermally connecting the heat spreader and the conducting member;

wherein a bottom surface of the first fins in whole defines a horizontal plane parallel to the lower base plate, the bottom surface of the first fins in whole is located above the lower base plate and there is a constant interval distance between the bottom surface of the first fins in whole and a top surface of the lower base plate.

8. The heat dissipation device as described in claim 7 , wherein the first fins are located between the upper base plate and the lower base plate, and arrayed into two groups separated by the connecting portion of the conducting member.

9. The heat dissipation device as described in claim 7 , wherein the upper and lower base plates and the first fins are integrally fabricated by metal extrusion, and there is a space between a bottom of the first fins and the lower base plate.

10. The heat dissipation device as described in claim 7 , wherein the first heat pipe comprises an evaporating portion sandwiched between the heat spreader and the lower base plate, a condensing portion parallel to the evaporating portion and sandwiched between the conducting member and the second fins, and an adiabatic portion interconnecting the evaporating portion and the condensing portion.

11. The heat dissipation device as described in claim 7 , further comprising a plurality of second fins mounted on the upper base plate of the conducting member.

12. The heat dissipation device as described in claim 11 , further comprising a second heat pipe, wherein the second heat pipe comprises an evaporating portion sandwiched between the heat spreader and the lower base plate, a condensing portion parallel to the evaporating portion and extending through the second fins, and an adiabatic portion interconnecting the evaporating portion and the condensing portion.

13. The heat dissipation device as described in claim 7 , further comprising a fan mounted adjacent to openings of air passages of the first fins.

14. A heat dissipation device for an electronic component comprising:

a first heat sink having a lower base plate adapted from thermally connecting with the electronic component, an upper base plate and a plurality of first fins extending from the upper base plate downwardly towards the lower base plate and spaced a distance from the lower base plate;

a first heat pipe having an evaporating portion located near and thermally connecting with the lower base plate and a condensing portion located near and thermally connecting with the upper base plate of the first heat sink; and

a second heat sink mounted on the first heat sink, and a second heat pipe, the condensing portion of the first heat pipe is sandwiched between the first and second heat sinks, the second heat pipe having an evaporating portion located near and thermally connecting with the lower base plate and a condensing portion engaging with the second heat sink;

wherein the first heat sink has a connecting portion interconnecting middle portions of the upper base plate and the lower base plate, the first fins being divided into two groups by the connecting portion; and

wherein the second heat sink has a plurality of second fins, and the condensing portion of the second heat pipe engages in the second fins.