IP Library Granted Patent US 7,286,346
Granted Patent B2
US 7,286,346 · App. 11/442,283 · Granted Oct 23, 2007

Peripheral device and electronic device

Assignee: Mitsubishi Denki Kabushiki Kaisha
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,286,346
App. No.
11/442,283
Granted
Oct 23, 2007
Kind
B2
Abstract

A peripheral device is detachably connected to a host device and includes: an electronic component that generates heat; an electrical connector for electrically connecting the electronic component to the host device; a heat transfer device having a first end thermally connected to the electronic component; and a heat transfer connector thermally connecting a second of the heat transfer device to the host device. The heat generated by the electronic component is discharged, or transferred, to the host device side through the heat transfer device and the heat transfer connector.

Claims (35)

1. An electronic device comprising a host device and a peripheral device detachably connected to the host device,

the peripheral device including:

an electronic component that generates heat;

a peripheral device side electrical connector electrically connected to the electronic component;

a peripheral device side heat pipe having a first end thermally connected to the electronic component; and

a peripheral device side heat transfer connector thermally connected to a second end of the peripheral device side heat pipe;

the host device including:

a host device side electrical connector detachably connected to the peripheral device side electrical connector;

a host device side heat transfer connector detachably connected to the peripheral device side heat transfer connector;

a host device side heat pipe having a first end thermally connected to the host device side heat transfer connector; and

external heat discharge means thermally connected to a second end of the host device side heat pipe, wherein

heat generated by the electronic component is transferred to the external heat discharge means through the peripheral device side heat pipe, the peripheral device side heat transfer connector, the host device side heat transfer connector, and the host device side heat pipe,

the external heat discharge means discharges the heat from the electronic device, and

the host device side heat pipe contains a first refrigerant and the peripheral device side heat pipe contain a second refrigerant, and the fast refrigerant has a vaporization temperature lower than the recondensation temperature of the second refrigerant.

2. The electronic device as claimed in claim 1 , wherein the peripheral device side heat transfer connector is connected to ground potential.

3. The electronic device as claimed in claim 1 , wherein the peripheral device is a transceiver for communications.

4. The electronic device as claimed in claim 1 , wherein the first refrigerant is ether and the second refrigerant is water.

5. An electronic device comprising a host device and a peripheral device detachably connected to the host device,

the peripheral device including:

an electronic component;

a peripheral device side electrical connector electrically connected to the electronic element;

a peripheral device side heat pipe having a first end thermally connected to the electronic component; and

a peripheral device side heat transfer connector thermally connected to a second end of the peripheral device side heat pipe;

the host device including:

a host device side electrical connector detachably connected to the peripheral device side electrical connector;

a host device side heat transfer connector detachably connected to the peripheral device side heat transfer connector;

a host device side heat pipe having a first end thermally connected to the host device side heat transfer connector; and

a heat source thermally connected to a second end of the host device side heat pipe, wherein

heat generated by the heat source is supplied to the electronic component through the host device side heat pipe,

the host device side heat pipe contains a first refrigerant,

the peripheral device side heat pipe contains a second refrigerant, and

the second refrigerant has a vaporization temperature lower than the recondensation temperature of the first refrigerant.

6. The electronic device as claimed in claim 5 , wherein the peripheral device side heat transfer connector is connected to ground potential.

7. The electronic device as claimed in claim 5 , wherein the peripheral device is a transceiver for communications.

8. The electronic device as claimed in claim 5 , wherein the first refrigerant is ether and the second refrigerant is water.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 30, 2006
From: CHIBA, OSAMU; MORIWAKI, SHOHEI
To: MITSUBISHI DENKI KABUSHIKI KAISHA
Reel/Frame 017935/0586 →
Priority Claims (1)
JP 2005-276348 · Sep 22, 2005 · national
Continuity (1)
Related Publication 20070064397A1 · Mar 22, 2007