Wafer-level tester with magnet to test latching micro-magnetic switches

1. A system for testing a plurality of micro-magnetic switches formed on a wafer, wherein each switch of the plurality of switches includes a cantilever and a coil, comprising:

a wafer chuck that holds a wafer;

at least one stepper motor that moves said wafer chuck to move the wafer;

a magnet proximate to the wafer that is positioned adjacent to a first switch of the plurality of switches;

a probe card proximate to the wafer that is positioned adjacent to the first switch, wherein the probe card mounts

a first set of probes that interface with contact areas of a coil associated with the first switch, and

a second set of probes that interface with conductors on the wafer associated with the cantilever of the first switch;

a current source electrically coupled to the first set of probes, wherein the current source activates the coil of the first switch using the first set of probes to switch the cantilever from a first state to a second state;

a source monitor unit electrically coupled to the second set of probes, wherein the source monitor unit determines whether the cantilever of the first switch is in the first state prior to the current source activating the coil of the first switch, and determines whether the cantilever is in the second state after the current source activates the coil of the first switch.

2. The system of claim 1 , wherein said at least one stepper motor moves said wafer in a direction substantially perpendicular to a plane of said wafer to interface said first set of probes with the contact areas of the coil of the first switch, and to interface said second set of probes with the conductors on the wafer associated with the cantilever of the first switch;

wherein said magnet induces a magnetization in a magnetic material of the cantilever of the first switch.

3. The system of claim 2 , wherein said at least one stepper motor moves said wafer in a second direction substantially perpendicular to the plane of said wafer to de-interface said first set of probes from the contact areas of the coil of the first switch, and to de-interface said second set of probes from the conductors associated with the cantilever of the first switch.

4. The system of claim 3 , wherein said at least one stepper motor moves said wafer in the plane of said wafer such that said magnet and said probe card are positioned adjacent to a cantilever of a second switch on the wafer.

5. The system of claim 4 , wherein said at least one stepper motor moves said wafer in the first direction substantially perpendicular to the plane of said wafer to interface said first set of probes with contact areas of a coil of the second switch, and to interface said second set of probes with conductors on the wafer associated with the cantilever of the second switch;

wherein said magnet induces a magnetization in a magnetic material of the cantilever of the second switch.

6. The system of claim 3 , wherein said at least one stepper motor step-wise moves said wafer in the plane of said wafer such that said magnet and said probe card are positioned adjacent to a cantilever corresponding to each switch of the plurality of switches on the wafer, one switch of the plurality of switches at a time.

7. The system of claim 6 , wherein said at least one stepper motor moves said wafer in the first direction substantially perpendicular to the plane of said wafer to interface said first set of probes with contact areas of a coil corresponding to a switch of the plurality of switches when positioned adjacently thereto, and to interface said second set of probes with conductors on the wafer for signals associated with the cantilever of the switch of the plurality of switches when positioned adjacently thereto;

wherein said magnet induces a magnetization in a magnetic material of the cantilever corresponding to the switch of the plurality of switches when positioned closely adjacent thereto.

8. The system of claim 1 , further comprising:

an inker for marking a switch on the wafer that has been determined by said source monitor unit to be defective.

9. The system of claim 1 , further comprising:

a controller electrically coupled to said at least one stepper motor, said current source, and said source monitor unit.

10. The system of claim 1 , further comprising:

optics that positions said magnet adjacent to the cantilever of the first switch.

11. The system of claim 1 , further comprising at least one additional magnet held in a fixed position relative to said first magnet, wherein said at least one additional magnet is positioned adjacent to at least one additional switch of the plurality of switches;

wherein said probe card further mounts:

at least one additional first set of probes that interfaces with contact areas of at least one additional coil associated with the at least one additional switch on the wafer, and

at least one additional second set of probes that interfaces with conductors on the wafer associated with at least one additional cantilever of the at least one additional switch.