Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same
View Patent ↗Method for manufacturing a parylene-based electrode array that includes an underlying parylene layer, one or more patterned electrode layers comprising a conductive material such as a metal, and one or more overlying parylene layers. The overlying parylene is etched away or otherwise processed to expose the electrodes where stimulation or recording is to occur. All other conductive material in the device is occluded from the environment by the two layers of parylene surrounding it.
1. A method of producing a flexible electrode array, the method comprising:
providing a parylene substrate wherein said substrate is formed by directly depositing a parylene layer onto a bulk substrate block;
forming a patterned conductive layer on the parylene substrate;
covering the patterned conductive layer with a parylene layer; and
removing a portion of the parylene layer so as to expose at least a portion of the patterned conductive layer to form an exposed electrode pattern in the parylene layer, wherein the patterned conductive layer comprises carbonized parylene.
2. A method of producing a flexible electrode array, the method comprising:
providing a parylene substrate;
forming a patterned conductive layer on the parylene substrate wherein the patterned conductive layer comprises carbonized parylene;
covering the patterned conductive layer with a parylene layer; and
removing a portion of the parylene layer so as to expose at least a portion of the patterned conductive layer to form an exposed electrode pattern in the parylene layer.
3. The method of claim 2 , wherein the patterned conductive layer comprises a conductive metal selected from the group consisting of gold, platinum, chromium, titanium, platinum and iridium oxide.
4. The method of claim 2 , wherein the parlyene substrate and the parylene layer each comprise one or more of parylene A, parylene C, parylene AM, parylene F, parylene N or parylene D.
5. The method of claim 2 , wherein providing a parylene substrate includes depositing parylene on a layer of photoresist overlaying a bulk substrate.
6. The method of claim 5 , further comprising separating the parylene substrate from the photoresist layer.
7. The method of claim 2 , wherein forming the patterned conductive layer comprises:
depositing a layer of photoresist on the parylene substrate;
patterning the photoresist with a mask;
removing the patterned photoresist to expose the parylene substrate;
depositing a conductive material on the exposed parylene substrate; and
removing the photoresist.
8. The method of claim 7 , wherein depositing a conductive material includes one of an e-beam evaporation process, a sputtering process or an electroplating process.
9. The method of claim 2 , wherein forming the patterned conductive layer comprises:
depositing a layer of conductive material on the parylene substrate;
patterning the conductive material with a mask;
removing exposed conductive material to expose the parylene substrate; and
removing the mask.
10. The method of claim 2 , wherein removing a portion of the parylene layer comprises:
depositing a layer of photoresist on the parylene layer;
patterning the photoresist with a mask;
removing the patterned photoresist to expose portions of the parylene layer; and
etching the exposed portions of the parylene layer.
11. The method of claim 2 , wherein the patterned conductive layer includes a conductive material selected from the group consisting of a conducting polymer, a doped semiconductor, and graphite.
12. The method of claim 2 , wherein removing a portion of the parylene layer comprises one of a plasma etch process, a laser ablation process, a blade cutting process or a melting process.
13. The method of claim 2 , further comprising:
forming a second patterned conductive layer on the parylene layer; and
covering the second patterned conductive layer with a second parylene layer.
14. The method of claim 13 , wherein removing a portion of the parylene layer occurs before the step of covering the second patterned conductive layer with a second parylene layer.
15. The method of claim 13 , wherein removing a portion of the parylene layer occurs after the step of covering the second patterned conductive layer with a second parylene layer.
16. The method of claim 2 , further comprising the following steps in order: treating a device comprising the parylene substrate and the parylene layer with an oxygen plasma, and exposing said substrate and layer to said oxygen plasma for a sufficient amount of time to increase the hydrophilicity of said parylene, said exposure easing implantation and wetting of said device.