Processor module with thermal dissipation device
View Patent ↗Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device extends between the processor and the system board. The second portion connects on top of the first portion and has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
1. An electronic module removably connectable to a system board, the electronic module comprising:
a first portion connected to the system board and including a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB, the thermal dissipation device extending between the processor and the system board; and
a second portion connected on top of the first portion, the second portion having a power system board for providing power to the processor, the power system board extending adjacent and parallel to a second side of the PCB.
2. The electronic module of claim 1 wherein the thermal dissipation device forms one side of the electronic module and the power system board forms an opposite side of the electronic module.
3. The electronic module of claim 1 wherein the PCB includes a second processor connected to the first side of the PCB, and the thermal dissipation device extends between both processors and the system board.
4. The electronic module of claim 1 wherein the thermal dissipation device directly contacts the processor and the system board for dissipating heat directly away from the processor and the system board.
5. The electronic module of claim 1 further comprising a second thermal dissipation device connected to the power system board, wherein the thermal dissipation device forms one side of the module and the second thermal dissipation device forms another, opposite side of the module.
6. The electronic module of claim 1 wherein the PCB has a second side, opposite the first side, and the second side is back-to-back with one side of the power system board.
7. The electronic module of claim 1 wherein heat generated by the processor is conducted, via a heat pipe, from the thermal dissipation device.
8. The electronic module of claim 1 wherein the second portion is removable from the first portion while the first portion remains connected to the system board.
9. The electronic module of claim 1 wherein the thermal dissipation device substantially fills a volume of space formed underneath the first side of the PCB.
10. A method, comprising:
connecting a first portion of an electronic module to a printed circuit board (PCB), the first portion having a thermal dissipation device and a processor board with plural processors;
connecting a second portion of the electronic module on lop of the first portion so a power board in the second portion is back-to-back with the processor board;
dissipating heat away from the plural processors with the thermal dissipation device; and
dissipating heat, with the thermal dissipation device, from the PCB and from other heat-generating components on the processor board.
11. The method of claim 10 further comprising dissipating heat from the thermal dissipation device using liquid heat exchange.
12. The method of claim 10 further comprising dissipating the heat from the first portion using a liquid cold plate.
13. The method of claim 10 further comprising disconnecting the second portion from the first portion while the first portion remains connected to the PCB.
14. The method o:f claim 10 further comprising:
providing DC power from the second portion to the first portion;
providing processing functionality from the first portion to the PCB;
dissipating heat from the first and second portions with the thermal dissipation device.
15. A method, comprising:
connecting a first portion of an electronic module to a printed circuit board (PCB), the first portion having a thermal dissipation device and a processor board with plural processors;
connecting a second portion of the electronic module on top of the first portion so a power board in the second portion is back-to-back with the processor board;
dissipating heat away from the plural processors with the thermal dissipation device; and
dissipating heat away from the power board with another thermal dissipation device.
16. An electronic module connectable to a system board, the electronic module, comprising:
a circuit board having at least one processor and memory;
a power board coupled, to form a vertically stacked-up configuration, to the circuit board for providing power to the circuit board; and
a thermal dissipation device disposed between the circuit board and the system board, wherein the thermal dissipation device contacts the processor for dissipating heat away from the processor.
17. The electronic module of claim 16 wherein the thermal dissipation device substantially fills a volume of space between the circuit board and the system board.
18. The electronic module of claim 16 wherein:
the electronic module has a rectangular configuration;
the thermal dissipation device forms a first side of the electronic module;
the power board forms a second side, opposite the first side, of the electronic module;
the thermal dissipation device dissipates heat, via a direct heat exchange, away from both the processor and the system board.
19. The electronic module of claim 16 further comprising a second thermal dissipation device coupled, to form a vertically stacked-up configuration, to the power board.