IP Library › Granted Patent US 7,336,486
Granted Patent B2
US 7,336,486 · App. 11/244,498 · Granted Feb 26, 2008

Synthetic jet-based heat dissipation device

Assignee: Intel Corporation
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Quick Facts
Patent No.
US 7,336,486
App. No.
11/244,498
Granted
Feb 26, 2008
Kind
B2
Abstract

A synthetic jet array in a computing device, such as a mobile computing device, to dissipate heat generated by a heat generating component of the mobile computer is described. In one embodiment, a microscale synthetic jet array is integrated within a heat generating component, either on the backside of the heat generating component itself or on a heat spreader coupled to the heat generating component. A method of fabricating a synthetic jet array as an integrated part of a computing device or as a heat spreader is described, as well as a method of use of the synthetic jet array, are described.

Claims (17)

1. A computing device, comprising:

a heat generating component;

a microscale synthetic jet to cool the heat generating component, the microscale synthetic jet further comprising:

an electrode on the heat generating component;

an actuator material over the electrode;

a chamber material over the actuator material;

an orifice and

a chamber in the chamber material to form a microscale synthetic jet operable to expel air heated by the heat generating component away from the heat generating component; and

a battery to power the computing device.

2. The computing device of claim 1 , wherein the microscale synthetic jet comprises an array of microscale synthetic jets.

3. A method of fabricating a cooling device, comprising:

forming an electrode on a heat generating component of a mobile device; depositing an actuator material over the electrode;

depositing a chamber material over the actuator material;

forming a hard mask material over the chamber material and patterning the hard mask material to form orifices of microscale synthetic jets;

etching the chamber material, using the hard mask as a pattern, to form chambers of microscale synthetic jets operable to expel heated air away from the cooling device.

4. The method of claim 3 , wherein etching the chamber material comprises anisotropically etching silicon.

5. The method of claim 3 , wherein depositing an actuator material comprises depositing a piezoelectric material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2005
From: MONGIA, RAJIV K.
To: INTEL CORPORATION
Reel/Frame 017076/0894 →
Continuity (1)
Related Publication 20070076375A1 · Apr 5, 2007