Capacitive pressure sensor and method of manufacturing the same
A capacitive pressure sensor and method of manufacturing the same is provided. The capactive pressure sensor includes a glass substrate that has a pair of surfaces opposite to each other. A recessed portion is provided to form a cavity on one of the pair of principal surfaces. A first protruding portion provided in the recessed portion. A first silicon substrate has a fixed electrode formed on the first protruding portion, and a movable electrode disposed with a predetermined interval between the fixed electrode and the movable electrode.
1. A capacitive pressure sensor comprising:
a glass substrate that has a pair of surfaces opposite to each other, a recessed portion provided to form a cavity on one of the pair of principal surfaces, and a first protruding portion provided in the recessed portion; and
a first silicon substrate that has a fixed electrode formed on the first protruding portion, and a movable electrode disposed with a predetermined interval between the fixed electrode and the movable electrode.
2. The capacitive pressure sensor according to claim 1 , further comprising:
a second silicon substrate that is bonded to the other principal surface of the glass substrate, and has a second protruding portion penetrating the glass substrate to be exposed through the one principal surface,
wherein the second protruding portion is exposed in a region other than the first protruding portion in the recessed portion, and the fixed electrode is electrically connected to the second protruding portion.
3. The capacitive pressure sensor according to claim 1 ,
wherein an Si—Si bond is generated at the interface between the glass substrate and the first and second silicon substrates.
4. The capacitive pressure sensor according to claim 1 ,
wherein an Si—O bond is generated at the interface between the glass substrate and the first and second silicon substrates.