Cooling device for heat-generating electronic component
A cooling device includes a heat sink ( 10 ), a fan ( 30 ), and a fan duct ( 50 ) covering the heat sink and fan therein. The heat sink includes a base ( 12 ) defining at least a through hole ( 18 ) at each of two opposite sides thereof. The fan duct comprises a top wall ( 52 ) and two side walls ( 54 ). A mounting portion ( 60 ) extends outwardly from a bottom of each side wall and has at least a tube ( 64 ) defining a mounting hole ( 640 ) in an outer wall thereof. A plurality of pins ( 70 ) extends through the through holes into the tubes. The pins have retaining rings ( 74 ) abutting against a bottom surface ( 120 ) of the base of the heat sink, and hooks ( 76 ) locked in the mounting holes.
1. A cooling device comprising:
a heat sink having a base defining a through hole at each of two opposite sides thereof;
a fan for generating an airflow to the heat sink; and
a fan duct assembly covering the heat sink and fan therein, the fan duct assembly comprising a fan duct having a top wall and two side walls extending downwardly from two opposite sides of the top wall and a plurality of pins, a mounting portion extending outwardly from each side wall and defining a tube corresponding to the through hole of the heat sink, the pins passing through the through holes and locked in the tubes, respectively;
wherein the mounting portion defines a groove above a corresponding through hole, and the tube extends downwardly in the groove and defines a mounting hole in an outer wall thereof.
2. The cooling device as claimed in claim 1 , wherein a pole extends downwardly from a central portion of the tube into a corresponding pin.
3. The cooling device as claimed in claim 1 , wherein the fan duct is integrally formed, and an arc hole is defined in the mounting portion corresponding to the mounting hole.
4. The cooling device as claimed in claim 1 , wherein a protrusion extends downwardly from a bottom surface of the mounting portion and abuts the base of the heat sink.
5. The cooling device as claimed in claim 4 , wherein the protrusion has an arc shaped outer surface.
6. The cooling device as claimed in claim 1 , wherein a post extends downwardly from the mounting portion for securing the cooling device on a circuit board.
7. The cooling device as claimed in claim 1 , wherein the fan defines a plurality of apertures, and a flange extends inwardly from a front edge of the fan duct near the fan, a plurality of bores being defined in the flange corresponding to the apertures of the fan.
8. The cooling device as claimed in claim 1 further comprising a louver connected with a lower portion of the fan, a plurality of loopholes being defined in the louver.
9. The cooling device as claimed in claim 8 , wherein the louver comprises a rod having a body and top and bottom heads, and the body is received in a corresponding aperture of the fan and the top and bottom heads sandwiches a wall of a frame of the fan therebetween.
10. The cooling device as claimed in claim 9 , wherein the louver is integrally formed with the rod and defines an orifice corresponding to the top head of the rod distant from the louver.
11. The cooling device as claimed in claim 1 , wherein each of the pins comprises a main body and a hook formed at a top end of the main body and a retaining ring formed at a bottom end of the main body, the retaining ring abutting a bottom surface of the heat sink.
12. The cooling device as claimed in claim 11 , wherein a slot is defined in the main body of each of the pins for enhancing flexibility of the pins.
13. The cooling device as claimed in claim 12 , wherein the hook extends downwardly and aslant from the top end of the main body.
14. The cooling device as claimed in claim 13 , wherein the retaining ring and the hook are alternately arranged along a circumferential direction of each of the pins.