Nanostructured soldered or brazed joints made with reactive multilayer foils
Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The rapid cooling results in a very fine microstructure of the solder or braze material. The scale of the fine microstructure of the solder or braze material is dependant on cooling rate of the reactive joints which varies with geometries and properties of the foils and components. The microstructure of the solder or braze layer of the joints formed by melting solder in a furnace is much coarser due to the slow cooling rate. Reactive joints with finer solder or braze microstructure show higher shear strength compared with those made by conventional furnace joining with much coarser solder or braze microstructure. It is expected that the reactive joints may also have better fatigue properties compared with conventional furnace joints.
1. A joined structure comprising a first body and a second body joined to the first body by a region comprising remnants of a reactive multilayer foil and a solder or braze,
wherein the solder or braze forms an eutectic alloy microstructure having a lamellar spacing of less than 100 nanometers, and wherein the combination of the bodies, the foil and the solder or braze is selected to produce a cooling rate in the solder or braze of greater than 1000° C./s after the reaction of the multilayer foil.
2. A joined structure comprising a first body and a second body joined to the first body by a region comprising remnants of a reactive multilayer foil and a solder or braze, wherein the solder or braze forms an eutectic alloy microstructure having a lamellar spacing of less than 50 nanometers, and wherein the combination of the bodies, the foil and the solder or braze is selected to produce a cooling rate in the solder or braze of greater than 1000° C./s after the reaction of the multilayer foil.
3. A joined structure comprising a first body and a second body joined to the first body by a region comprising remnants of a reactive multilayer foil and a solder or braze, wherein the solder or braze forms an eutectic alloy microstructure having a lamellar spacing of less than 10 nanometers, and wherein the combination of the bodies, the foil and the solder or braze is selected to produce a cooling rate in the solder or braze of greater than 1000° C./s after the reaction of the multilayer foil.