Structure for protection against radio disturbances

1. A structure of protection of a first area of a semiconductor wafer including a substrate of a first conductivity type against high-frequency noise likely to be injected from components formed in the upper portion of a second area of the wafer, comprising:

a heavily-doped wall of the first conductivity type having substantially the depth of said upper portion, wherein said wall is divided into three heavily-doped strips of the first conductivity type separated and surrounded by medium-doped intermediary strips of the first conductivity type, the distance between the end heavily-doped strips being of the order of magnitude of the substrate thickness.

2. The structure of claim 1 wherein the first conductivity type is type P.

3. The structure of claim 1 wherein each of the three heavily-doped P-type strips is divided into successive segments.

4. The structure of claim 3 wherein each segment is connected to a ground plane via a flip-chip assembly.

5. A device comprising:

a semiconductor substrate; and

a barrier formed in the semiconductor substrate and configured to separate a first region of the semiconductor substrate from a second region of the semiconductor substrate, the barrier having three heavily doped strips of a first type of conductivity, the three strips being separated by two medium-doped strips of the first type of conductivity, each of the three strips being connected to a circuit ground.

6. The device of claim 5 wherein the barrier further includes a medium doped strip of the first type of conductivity on either side of the barrier, in the same plane as the three strips.

7. The device of claim 5 wherein each of the three heavily doped strips is divided into a plurality of segments and wherein each of the plurality of segments is individually connected to the circuit ground.

8. The device of claim 7 wherein the segments are configured such that a gap between segments of one of the three strips is not directly aligned with a gap between segments of an adjoining one of the three strips.

9. The device of claim 5 wherein the width of the barrier is in the same order of magnitude as the thickness of the semiconductor substrate.

10. The device of claim 5 , further comprising a circuit formed in the first region of the semiconductor substrate.

11. The device of claim 10 wherein the barrier surrounds the circuit.

12. A method, comprising:

generating a high frequency noise signal in a first integrated circuit formed in a semiconductor substrate; and

blocking the high frequency noise signal from interfering with a second integrated circuit formed in the substrate through the use of a protective structure formed in the substrate, the structure having three heavily doped strips of a first type of conductivity, the three strips being separated by two medium-doped strips of the first type of conductivity, the structure being configured to separate the second integrated circuit from the first integrated circuit, each of the three strips being connected to a circuit ground.

13. The method of claim 12 wherein the structure surrounds the second integrated circuit.

14. The method of claim 12 wherein the structure further includes a medium doped strip of the first type of conductivity on either side of the barrier, in the same plane as the three strips.

15. The method of claim 12 wherein each of the three heavily doped strips are divided into a plurality of segments and wherein each of the plurality of segments is individually connected to the circuit ground.