IP Library › Granted Patent US 7,396,696
Granted Patent B2
US 7,396,696 · App. 11/463,474 · Granted Jul 8, 2008

Method for manufacturing super bright light emitting diode of nanorod array having InGaN quantum well

Assignee: Dongguk University Industry Academic Cooperation Foundation
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Quick Facts
Patent No.
US 7,396,696
App. No.
11/463,474
Granted
Jul 8, 2008
Kind
B2
Abstract

An GaN light emitting diode (LED) having a nanorod (or, nanowire) structure is disclosed. The GaN LED employs GaN nanorods in which a n-type GaN nanorod, an InGaN quantum well and a p-type GaN nanorod are subsequently formed in a longitudinal direction by inserting the InGaN quantum well into a p-n junction interface of the p-n junction GaN nanorod. In addition, a plurality of such GaN nanorods are arranged in an array so as to provide an LED having much greater brightness and higher light emission efficiency than a conventional laminated-film GaN LED.

Claims (21)

1. A method for manufacturing a light emitting diode (LED), comprising:

forming a plurality of first-conductive type GaN nanorods in an array perpendicular to a substrate;

forming an InGaN quantum well on each first-conductive type GaN nanorod;

forming a second-conductive type GaN nanorod on each InGaN quantum well;

forming an electrode pad for applying voltage to the first-conductive type GaN nanorods; and

forming a transparent electrode to be commonly connected to the second-conductive type GaN nanorods for supplying voltage thereto.

2. A method for manufacturing an LED according to claim 1 , further comprising, after the step of forming the second-conductive type GaN nanorods:

filling a transparent insulating material among the nanorods including the first-conductive type GaN nanorods, the InGaN quantum wells and the second-conductive type GaN nanorods.

3. A method for manufacturing an LED according to claim 2 , wherein the transparent insulating material is SOG (Spin-On-Glass), SiO2 or an epoxy resin.

4. A method for manufacturing an LED according to claim 2 , wherein a fluorescent material is added to the transparent insulating material so that a light emitted from the LED becomes a white light as a whole.

5. A method for manufacturing an LED according to claim 1 ,

wherein the quantum well forming step repeatedly forms InGaN layers and GaN barrier layers in turns so as to form a multi quantum well.

6. A method for manufacturing an LED according to claim 1 ,

wherein the first-conductive type GaN nanorods, the InGaN quantum wells and the second-conductive type GaN nanorods are formed in-situ using MO-HVPE (metalorganic-hydride vapor phase epitaxy).

7. A method for manufacturing an LED according to claim 1 ,

wherein the substrate is a sapphire substrate,

wherein the method further comprises a step of forming a first-conductive type GaN buffer layer on the sapphire substrate before the first-conductive type GaN nanorod forming step, and

wherein the electrode pad is formed on a part of the GaN buffer layer.

8. A method for manufacturing an LED according to claim 1 ,

wherein the substrate is a silicon substrate,

wherein the electrode pad is formed on a surface of the silicon opposed to a surface formed by the nanorods.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 22, 2008
From: DONGGUK UNIVERSITY
To: DONGGUK UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION
Reel/Frame 020839/0693 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2006
From: KIM, HWA-MOK; KANG, TAE-WON; CHUNG, KWAN-SOO
To: DONGGUK UNIVERSITY
Reel/Frame 018660/0017 →
Continuity (2)
Division 1077919700 · Feb 13, 2004
Related Publication 20070077670A1 · Apr 5, 2007