Wiring configuration for semiconductor component
In a wiring configuration for a semiconductor component, an unused terminal is insulated from a third land via an insulating film, and thus no connecting member (solder) is required for the unused terminal. With this, the third land is not accidentally removed from a circuit board during exchange of the semiconductor component, and the number of defective circuit boards can be reduced. Moreover, the third land for the unused terminal is included in a wiring pattern due to the connection thereof to other lands or other traces for signals and for grounding with a connecting trace. Thus, the widths of lines can be increased, and furthermore, the insusceptibility of transmission lines in high-frequency circuits to noise can be increased.
1. A wiring configuration for a semiconductor component comprising:
a semiconductor component including a main body and a plurality of terminals provided for the main body; and
a circuit board including a wiring pattern to which the terminals are connected, wherein
the terminals of the semiconductor component include a signal terminal, a ground terminal, and an unused terminal;
the wiring pattern includes a first trace for signals having a first land corresponding to the signal terminal, a second trace for grounding having a second land corresponding to the ground terminal, and a third land corresponding to the unused terminal;
the third land is connected to the first land, the second land, or one of the traces of the wiring pattern by a connecting trace; and
the signal terminal and the ground terminal are connected to the first land and the second land, respectively, using a connecting member while the unused terminal is insulated from the third land using an insulating film.
2. The wiring configuration for a semiconductor component according to claim 1 , wherein the third land is connected to the second trace.
3. The wiring configuration for a semiconductor component according to claim 1 , wherein the third land is connected to the second land that is disposed adjacent to the third land.
4. The wiring configuration for a semiconductor component according to claim 1 , wherein the insulating film is a resist film or a silk film.
5. The wiring configuration for a semiconductor component according to claim 1 , wherein the second trace extends so as to face the lower surface of the main body, and a metallic body disposed on the lower surface of the main body is in contact with the second trace.
6. The wiring configuration for a semiconductor component according to claim 5 , wherein the circuit board disposed under the lower surface of the main body has a thermal via that is connected to the second trace.
7. The wiring configuration for a semiconductor component according to claim 5 , wherein the second trace is connected to a heat-radiating member.