Method for encapsulating an electronic component using a foil layer
The invention relates to a method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of: a) placing at least one foil layer in a mould, b) placing the carrier in contact with the foil layer with the side remote from the component, and c) encapsulating the electronic component with encapsulating material, wherein the foil layer undergoes a treatment whereby the adhesion of the foil layer is increased such that it adheres to the carrier. The invention also relates to a foil material for applying during such a method.
1. A method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of:
a) placing at least one foil layer in a mould,
b) placing the carrier in contact with the foil layer with the side remote from the component, and
c) encapsulating the electronic component with encapsulating material,
wherein the adhesion of the foil layer is increased in combination with encapsulation of the electronic component,
wherein the adhesion of the foil layer is increased with a separate adhesion-increasing treatment before placing the foil layer in the mould according to processing step a).
2. The method as claimed in claim 1 , wherein the foil layer undergoes the adhesion-increasing treatment before the carrier is brought into contact with the foil layer.
3. The method as claimed in claim 1 , wherein the adhesion-increasing treatment comprises a temperature increase of the foil.
4. The method as claimed in claim 1 , wherein the adhesion-increasing treatment comprises a corona treatment or plasma treatment.
5. The method as claimed in claim 1 , wherein after the adhesion-increasing treatment is performed, the foil adheres particularly to a contact surface of the carrier consisting at least substantially of copper.
6. The method as claimed in claim 1 , wherein the foil undergoes a subsequent treatment after encapsulation of the electronic component with encapsulating material, whereby the adhesion of the foil layer is decreased such that it adheres less to the carrier than during encapsulation of the electronic component with encapsulating material.
7. The method as claimed in claim 6 , wherein the treatment for reducing adhesion comprises a temperature decrease of the foil.
8. The method as claimed in claim 1 , wherein the foil is unwound from a roll and then moved through the mould.
9. The method as claimed in claim 1 , wherein the foil is used a number of times.
10. Foil for applying the method as claimed in claim 1 , wherein the foil comprises a carrier layer having arranged thereon an adhesive layer which can be activated.
11. Foil as claimed in claim 10 , wherein the adhesive layer which can be activated comprises a thermoplastic plastic.
12. Foil as claimed in claim 10 , wherein the carrier layer consists of paper.
13. Foil as claimed in claim 10 , wherein the carrier layer consists of plastic.
14. Foil as claimed in claim 10 , wherein the carrier layer consists of a non-ferrous metal.
15. Foil as claimed in claim 10 , wherein the foil is reusable.