Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board

1. A package structure to be mounted on an external printed circuit board, said package structure comprising:

a package board that is mounted with an exoergic circuit element;

a heat sink that radiates heat from the exoergic circuit element;

a first pressure mechanism that applies a first pressure for operatively connecting the heat sink to the package board; and

a second pressure mechanism that applies a second pressure for operatively connecting the package board to the printed circuit board, said second pressure mechanism being separate from said first pressure mechanism and an application of the first pressure by said first pressure mechanism being independent of an application of the second pressure by said second pressure mechanism.

2. A package structure according to claim 1 , wherein the first pressure is less than the second pressure.

3. A package structure according to claim 1 , further comprising a socket, provided on said package board, which electrically connects said package structure to the printed circuit board.

4. A package structure according to claim 1 , wherein said package board is made of resin.

5. A package structure to be mounted on an external printed circuit board, said package structure comprising:

a package board that is mounted with an exoergic circuit element;

a heat sink that radiates heat from the exoergic circuit element, wherein first pressure for connecting the heat sink to the package board is separated from second pressure for compressing the package board against the printed circuit board; and

a heat spreader that thermally connects the heat sink to the exoergic circuit element, and has a convex section.

6. A package structure according to claim 1 , further comprising a heat spreader that thermally connects the heat sink to the exoergic circuit element, and is not connected with the package board.

7. A package structure according to claim 1 , wherein said heat sink is connected to the exoergic circuit element.

8. A package structure to be mounted onto an external printed circuit board, said package structure comprising:

a package board that is mounted with an exoergic circuit element;

a heat sink that radiates heat from the exoergic circuit element;

a stiffener located between the heat sink and the package board around the exoergic circuit element;

a first pressure mechanism that applies a first pressure for operatively connecting one of the heat sink and the stiffener to the other; and

a second pressure mechanism that applies a second pressure for operatively connecting the stiffener to the printed circuit board, said second pressure mechanism being separate from said first pressure mechanism and an application of the first pressure by said first pressure mechanism being independent of an application of the second pressure by said second pressure mechanism.

9. A package structure according to claim 8 , further comprising a socket, provided on the package board, which connects the package structure with the printed circuit board electrically.

10. A package structure according to claim 8 , wherein the package board is made of resin.

11. A package structure according to claim 8 , wherein the stiffener is larger than an external form of the package board.

12. A package structure according to claim 8 , wherein said heat sink is connected to the exoergic circuit element.

13. A package structure to be mounted onto an external printed circuit board, said package structure comprising:

a package board that is mounted with an exoergic circuit element;

a heat sink that radiates heat from the exoergic circuit element;

a stiffener located between the heat sink and the package board around the exoergic circuit element;

a first pressure mechanism that presses one of the heat sink and the stiffener against the other;

a second pressure mechanism that compresses the stiffener against the printed circuit board; and

a heat spreader that thermally connects the heat sink with the exoergic circuit element, and has a convex section.

14. A package structure according to claim 8 , further comprising a heat spreader that thermally connects the heat sink with the exoergic circuit element, and is not connected with the package board.

15. A package structure to be mounted onto an external printed circuit board, said package structure comprising:

a package board that is mounted with an exoergic circuit element;

a heat sink that radiates heat from the exoergic circuit element;

a stiffener located between the heat sink and the package board around the exoergic circuit element and adhered to the package board;

a first pressure mechanism that presses one of the heat sink and the stiffener against the other; and

a second pressure mechanism that compresses the stiffener against the printed circuit board.