Radio-frequency module for communication
A communication radio-frequency module is provided that has a semiconductor device to which an antenna element is connected. This communication radio-frequency module includes: a supporting body that has a waveguide formed therein; a wiring board that is fixed onto a surface of the supporting body; the semiconductor device that is flip-chip mounted onto the wiring board by ultrasonic bonding; and the antenna element that is disposed on the other surface of the supporting body. In this module, the wiring board includes a board core member that is made of a resin material, and the supporting body includes a supporting body core member that is also made of a resin material.
1. A communication radio-frequency module that has a semiconductor device to which an antenna element is connected, comprising:
a supporting body;
a wiring board that is fixed onto a first surface of the supporting body;
the semiconductor device that is flip-chip mounted onto the wiring board;
the antenna element that is disposed on a second surface that is opposite from the first surface of the supporting body;
a waveguide that penetrates the supporting body, and has an opening through the first surface and the second surface; and
a waveguide converter that is disposed at a location on the surface of the wiring board on the side of the supporting body, the location being set to face the opening of the waveguide,
the semiconductor device being connected to the antenna element via a vertical wiring unit that is disposed on the wiring board, the waveguide converter, and the waveguide,
the wiring board comprising a board core member that is made of a first resin material,
the supporting body comprising:
a supporting body core member that is made of a second resin material; and
an inorganic film that is located on the side of the first surface and has a higher coefficient of elasticity than the second resin material.
2. The communication radio-frequency module as claimed in claim 1 , wherein the inorganic film is a conductive film.
3. The communication radio-frequency module as claimed in claim 1 , wherein the supporting body core member is either a glass fabric epoxy laminated substrate or a multilayer substrate that is impregnated with styrene butadiene resin.
4. The communication radio-frequency module as claimed in claim 1 , wherein the second resin material is one of a resin material, a composite material that is formed by impregnating a glass fabric base material with a resin material, and a group of composite materials that are formed by impregnating glass fabric base materials with resin materials.
5. The communication radio-frequency module as claimed in claim 1 , wherein the first resin material has a relative permittivity of 4 or lower.
6. The communication radio-frequency module as claimed in claim 1 , wherein the waveguide is a hallow waveguide.
7. The communication radio-frequency module as claimed in claim 2 , wherein the conductive film is further formed on the second surface.
8. A communication radio-frequency module that has a semiconductor device to which an antenna element is connected, comprising:
a supporting body;
a wiring board that is fixed onto a first surface of the supporting body;
the semiconductor device that is flip-chip mounted onto the wiring board;
the antenna element that is disposed on a second surface that is opposite from the first surface of the supporting body;
a waveguide that penetrates the supporting body, and has an opening through the first surface and the second surface; and
a waveguide converter that is disposed at a location on the surface of the wiring board on the side of the supporting body, the location being set to face the opening of the waveguide,
the semiconductor device being connected to the antenna element via a vertical wiring unit that is disposed on the wiring board, the waveguide converter, and the waveguide,
the wiring board comprising a board core member that is made of a first resin material,
the supporting body comprising:
a supporting body core member that is made of a second resin material; and
a metal film that is formed on the side of the first surface.
9. The communication radio-frequency module as claimed in claim 8 , wherein the metal film is further disposed on the second surface.
10. The communication radio-frequency module as claimed in claim 8 , wherein the supporting body has an inorganic film that is interposed between the supporting body core member and the metal film, and is made of a material with a higher coefficient of elasticity than the second resin material.
11. A communication radio-frequency module that has a plurality of antenna elements, and a transmission semiconductor device and a plurality of reception semiconductor devices that are connected to the antenna elements,
the communication radio-frequency module comprising:
a supporting body;
a wiring board that is fixed onto a first surface of the supporting body;
a semiconductor device that is flip-chip mounted onto the wiring board;
the plurality of antenna elements that are disposed on a second surface that is opposite from the first surface of the supporting body, the antenna elements being arranged at a distance from one another;
a waveguide that penetrates the supporting body, and has an opening through the first surface and the second surface; and
a waveguide converter that is disposed at a location on the surface of the wiring board on the side of the supporting body, the location being set to face the opening of the waveguide,
the transmission semiconductor device being connected to the corresponding one of the antenna elements via a vertical wiring unit that is disposed on the wiring board, the waveguide converter, and the waveguide,
the wiring board comprising a board core member that is made of a first resin material,
the supporting body comprising:
a supporting body core member that is made of a second resin material; and
a metal film that is formed on the side of the first surface.
12. The communication radio-frequency module as claimed in claim 11 , wherein:
the transmission semiconductor device supplies a transmission signal to the corresponding one of the antenna elements, from which a transmission wave is radiated;
the transmission wave irradiates an object to be measured that is located at a distance from the communication radio-frequency module, the plurality of antenna elements receiving the transmission wave reflected; and
the plurality of reception semiconductor devices measure the distance, orientation, and relative velocity between the communication radio-frequency module and the object to be measured, based on the received reflected wave.