System and method for securing headphone transducers
View Patent ↗A system for securing headphone transducers is provided. In one aspect of the present invention, the system comprises a first transducer device having a first mechanical housing, which has an outer surface and an inner surface. A first coupling device is affixed to the outer surface of the first mechanical housing of the first transducer device. A second transducer device has a second mechanical housing, which has an outer surface and an inner surface. A second coupling device is affixed to the outer surface of the second mechanical housing of the second transducer device. The first coupling device is coupled to the second coupling device when in close proximity to each other, such that the inner surfaces of the first and second mechanical devices are opposed to each other.
1. A system for modifying a preexisting headphone transducer having a wire connected thereto, the system comprising:
a first backing device having an inner surface and an outer surface, and comprising:
a first conductive material at least partially covering the inner surface of said first backing device;
a bonding layer at least partially disposed on said first conductive material; and
a coupling device affixed to the outer surface of said first backing device; and
a second backing device having an inner surface and an outer surface, and comprising:
a second conductive material at least partially covering the inner surface of said second backing device,
wherein said first backing device is affixed to one side of the wire of the headphone transducer and said second first backing device is affixed to the other side of the wire of the headphone transducer, and
said backing devices mate with each other to securely attach to the wire of the headphone transducer.
2. The system of claim 1 , wherein said first and second conductive materials are at least one of a strip of foam, plastic, and material.
3. The system of claim 1 , wherein said second backing device further comprises a second bonding layer at least partially disposed on said second conductive material.
4. The system of claim 3 , wherein said second bonding layer is an adhesive layer.
5. The system of claim 1 , wherein said first bonding layer is an adhesive layer.
6. The system of claim 1 , wherein said coupling device is at least one of a magnet, hook, and loop.