Apparatus for directing plasma flow to coat internal passageways
An apparatus for coating surfaces of a workpiece is configured to establish a pressure gradient within internal passageways through the workpiece, so that the coating within the internal passageways exhibits intended characteristics, such as those relating to smoothness or hardness. The coating apparatus may include any or all of a number of cooperative systems, including a plasma generation system, a manipulable workpiece support system, an ionization excitation system configured to increase ionization within or around the workpiece, a biasing system for applying a selected voltage pattern to the workpiece, and a two-chamber system that enables the plasma generation to take place at a first selected pressure and the deposition to occur at a second selected pressure.
1. An apparatus for coating surfaces of a workpiece having at least one internal passageway comprising:
a plasma source for generating a plasma which includes ions of a coating material to be deposited on said surfaces of said workpiece;
a support configured to secure said workpiece in a specific orientation in spaced apart relationship with respect to said plasma source;
a plasma flow system enabled to direct a controlled flow of said plasma having said ions from said plasma source into each said internal passageway and to exhaust said plasma from said workpiece when said workpiece is secured to said support; and
an ionization excitation system configured to increase ionization said plasma while within said workpiece, said ionization excitation system including a biasing arrangement applied to said workpiece when said workpiece is secured to said support, said ionization excitation system further including a pressure control set to induce oscillation of electrons of said plasma within said workpiece, such that said ionization excitation system is configured to apply hollow cathode techniques within said workpiece.
2. The apparatus of claim 1 wherein said support positions said workplace in a deposition chamber and wherein said plasma flow system defines a pressure regime in which at least one internal passageway opening of said workpiece is exposed to said deposition chamber and at least one other internal passageway opening of said workpiece is exposed to a pumping system of said plasma flow system, such that flow Is directed through each said internal passageway with entrance and exit of said flow being through said internal passageway openings.
3. The apparatus of claim 1 wherein a flow rate through each said internal passageway is controllable by variation of an adjustable opening in said support from said deposition chamber to said pumping system.
4. The apparatus of claim 1 further comprising a low pressure source chamber and a high pressure deposition chamber, said plasma source being located within said low pressure source chamber, said support being positioned such that said workpiece is within said high pressure deposition chamber, said low pressure deposition chamber being connected to a vacuum source which maintains a lower pressure than within said high pressure deposition chamber.
5. The apparatus of claim 4 wherein said low pressure source chamber and said high pressure deposition chamber combine to form a cathodic arc system.
6. The apparatus of claim 5 wherein said cathodic arc system provides physical vapor deposition (PVD), said plasma flow system including a magnetic steering region in which a magnetic field is established to direct ionized plasma from said plasma source to said workpiece.
7. The apparatus of claim 6 wherein said plasma flow system further includes a vacuum control arrangement having a first evacuation of said low pressure source chamber and a second evacuation of said high pressure source chamber, said second evacuation being through said workpiece, such that
(a) said magnetic steering region defines a first flow regime; and
(b) said second evacuation defines a second flow regime.
8. The apparatus of claim 4 wherein an interface region from said high pressure source chamber to said low pressure deposition region has a decreasing cross sectional dimension.
9. The apparatus of claim 8 wherein said interface region is biased to repel ions of said plasma.
10. The apparatus of claim 1 further comprising a device for increasing ionization of said plasma in an area of said support.
11. The apparatus of claim 10 wherein said device is a microwave source.
12. The apparatus of claim 10 wherein said device is one of a radio frequency (RF) source, an electron cyclotron resonance (ECR) source or a distributed ECR source.
13. The apparatus of claim 1 wherein said biasing arrangement applies a bias to said workpiece to attract ions to surfaces of each said internal passageway of said workpiece.
14. The apparatus of claim 13 further comprising a biasing source for adjusting a bias magnitude and a duty cycle of said bias connection to said workpiece.
15. The apparatus of claim 1 wherein said support is configured to capture said workpiece having a plurality of said internal passageways in which said internal passageways have different cross sectional dimensions, said plasma flow system being cooperative with said support such that said plasma enters each of said internal passageways to form a continuous flow therethrough.
16. The apparatus of claim 15 wherein said plasma flow system is adjustable with respect to defining flow rates through said internal passageways of said workpiece.
17. The apparatus of claim 1 wherein pressure within said internal passageways obtained by using said plasma flow system results in an electron mean free path that is equal to or less than a minimum internal diameter of said at least one internal passageway, such that application of a negative bias to said workpiece by said biasing arrangement generates a hollow cathode condition for generating and maintaining ionization of a background gas, said biasing arrangement comprising a biasing source.
18. The apparatus of claim 17 wherein said biasing source has an adjustable duty cycle and magnitude to enable changes in the coating quality during deposition, said negative bias being selected to cause re-sputtering of said coating material initially deposited at each upstream end of said at least one internal passageway for redeposition downstream of said upstream end, wherein re-sputtered coating material is carried downstream with velocity of flow.
19. A coating apparatus comprising:
a plasma generation system for supplying an ionized plasma using cathodic arc techniques, said plasma generation system being configured to supply said ionized plasma to include ions of coating material to be deposited;
a deposition chamber downstream of said plasma generation system with respect to plasma flow;
a workpiece support system within said deposition chamber to position a workpiece such that said plasma flow necessarily and continuously is through all of a plurality of internal passageways within said workpiece; and
an ionization excitation system configured to increase ionization of said coating material within said plasma flow through said internal passageways, said ionization excitation system including a biasing arrangement and pressure control configured to induce oscillations of electrons within said plasma flow, so as to apply hollow cathode techniques within each said internal passageway;
wherein said internal passageways are coated via physical vapor deposition (PVD).
20. The coating apparatus of claim 19 wherein said pressure control is an element of an adjustable flow control system configured to set plasma flow rates through said internal passageways of said workpiece.