IP Library Granted Patent US 7,452,213
Granted Patent B2
US 7,452,213 · App. 11/517,842 · Granted Nov 18, 2008

Electrical contacts with compliant supports

Assignee: Seagate Technology LLC
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Quick Facts
Patent No.
US 7,452,213
App. No.
11/517,842
Granted
Nov 18, 2008
Kind
B2
Abstract

An assembly comprises a flex circuit including a first set of electrical contacts on a first side of the flex circuit and a compliant support backing adjacent a second side of the flex circuit and opposite the set of electrical contacts. The first set of electrical contacts is configured to connect to a second set of electrical contacts on an electronic component. The compliant support backing includes a set of support elements that individually support the first set of electrical contacts to increase the contact pressure between the first set of electrical contacts and the second set of electrical contacts when the flex circuit is connected to the electronic component. Embodiments may provide robust electrical contracts which provide a reliable connection useful for testing electronic components, such as head gimbal assemblies.

Claims (28)

1. An assembly comprising:

a flex circuit including a first set of electrical contacts on a first side of the flex circuit, wherein the first set of electrical contacts is configured to connect to a second set of electrical contacts on an electronic component; and

a compliant support backing adjacent a second side of the flex circuit and opposite the first set of electrical contacts, wherein the compliant support backing includes a set of support elements that individually support the first set of electrical contacts to increase the contact pressure between the first set of electrical contacts and the second set of electrical contacts when the flex circuit is connected to the electronic component,

wherein the set of support elements is substantially flat.

2. The assembly of claim 1 , wherein the first set of electrical contacts include raised pads located on a set of traces on the flex circuit.

3. The assembly of claim 2 , wherein the raised pads comprise plated electrical contacts.

4. The assembly of claim 1 , wherein the compliant support backing comprises metal.

5. The assembly of claim 1 , wherein the compliant support backing forms at least part of a cover that substantially covers the second side of the flex circuit.

6. The assembly of claim 5 , wherein the cover comprises metal.

7. An assembly comprising:

a flex circuit including a first set of electrical contacts on a first side of the flex circuit, wherein the first set of electrical contacts is configured to connect to a second set of electrical contacts on an electronic component; and

a compliant support backing adjacent a second side of the flex circuit and opposite the first set of electrical contacts, wherein the compliant support backing includes a set of support elements that individually support the first set of electrical contacts to increase the contact pressure between the first set of electrical contacts and the second set of electrical contacts when the flex circuit is connected to the electronic component,

a top cover and a bottom cover, wherein the bottom cover substantially covers the first side of the flex circuit except for a portion adjacent to the first set of electrical contacts.

8. The assembly of claim 7 , wherein the bottom cover forms a recess sized to hold the flex circuit.

9. The assembly of claim 1 , further comprising at least one preamp that connects to the first set of electrical contacts.

10. The circuit of claim 9 , wherein the at least one preamp is located on the flex circuit adjacent to the first set of electrical contacts.

11. The assembly of claim 1 , wherein the electronic component is a head gimbal assembly.

12. A circuit comprising:

a substantially flat substrate;

set of traces that terminate near an edge of the substrate; and

a set of plated electrical contacts that connect to the set of traces, wherein the set of plated electrical contacts is located near the edge of the substrate,

wherein the substrate includes a relief between each of the set of plated electrical contacts.

13. The circuit of claim 12 , wherein the substrate is flexible.

14. The circuit of claim 13 , wherein the substrate comprises plastic.

15. The circuit of claim 12 , further comprising at least one preamp that connects to the set of plated electrical contacts via the set of traces.

16. The circuit of claim 15 , wherein the at least one preamp is located adjacent to the set of plated electrical contacts.

17. The circuit of claim 12 , wherein the set of plated electrical contacts is higher than the set of traces relative to the substrate.

18. The circuit of claim 12 , wherein the relief between each of the set of plated electrical contacts is configured to coincide with a set of support elements that individually support each of the set of plated electrical contacts.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Jul 23, 2025
From: THE BANK OF NOVA SCOTIA
To: SEAGATE TECHNOLOGY PUBLIC LIMITED COMPANY; SEAGATE TECHNOLOGY; SEAGATE TECHNOLOGY HDD HOLDINGS; I365 INC.; SEAGATE TECHNOLOGY LLC; SEAGATE TECHNOLOGY INTERNATIONAL; SEAGATE HDD CAYMAN; SEAGATE TECHNOLOGY (US) HOLDINGS, INC.
Reel/Frame 072193/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Jul 19, 2013
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT AND SECOND PRIORITY REPRESENTATIVE
To: SEAGATE TECHNOLOGY LLC; EVAULT INC. (F/K/A I365 INC.); SEAGATE TECHNOLOGY INTERNATIONAL; SEAGATE TECHNOLOGY US HOLDINGS, INC.
Reel/Frame 030833/0001 →
SECURITY AGREEMENT Recorded Mar 24, 2011
From: SEAGATE TECHNOLOGY LLC
To: THE BANK OF NOVA SCOTIA, AS ADMINISTRATIVE AGENT
Reel/Frame 026010/0350 →
RELEASE Recorded Jan 19, 2011
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SEAGATE TECHNOLOGY HDD HOLDINGS; MAXTOR CORPORATION; SEAGATE TECHNOLOGY LLC; SEAGATE TECHNOLOGY INTERNATIONAL
Reel/Frame 025662/0001 →
SECURITY AGREEMENT Recorded May 15, 2009
From: MAXTOR CORPORATION; SEAGATE TECHNOLOGY LLC; SEAGATE TECHNOLOGY INTERNATIONAL
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND FIRST PRIORITY REPRESENTATIVE; WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT AND SECOND PRIORITY REPRESENTATIVE
Reel/Frame 022757/0017 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2008
From: SEAGATE TECHNOLOGY LLC
To: XYRATEX TECHNOLOGY LIMITED
Reel/Frame 021760/0984 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2006
From: HERDENDORF, BRETT R.; ANDERSON, RONALD E.; ROE, MICHAEL J.
To: SEAGATE TECHNOLOGY LLC
Reel/Frame 018278/0346 →
Continuity (1)
Related Publication 20080064234A1 · Mar 13, 2008