IP Library › Granted Patent US 7,461,272
Granted Patent B2
US 7,461,272 · App. 11/016,917 · Granted Dec 2, 2008

Device, system and method of thermal control

Assignee: Intel Corporation
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Quick Facts
Patent No.
US 7,461,272
App. No.
11/016,917
Granted
Dec 2, 2008
Kind
B2
Abstract

Briefly, some embodiments of the invention may provide devices, systems and methods for thermal control. For example, a method in accordance with an embodiment of the invention may include modifying an operational parameter of a processor based on a temperature of a heat sink associated with the processor.

Claims (32)

1. A method comprising:

determining an operational parameter of a processor based on a temperature of a heat sink associated with the processor;

determining a power of said processor based on said temperature of the heat sink and based on a thermal resistance parameter; and

modifying the operational parameter of the processor based on the temperature of the heat sink.

2. The method of claim 1 , comprising sensing said temperature of said heat sink at one or more pre-defined locations.

3. The method of claim 1 , wherein said modifying comprises:

if said temperature is higher than a pre-defined threshold value, reducing an operational parameter selected from a group including a frequency of said processor, said power of said processor, a current of said processor, and a voltage of said processor.

4. The method of claim 1 , comprising sending a request to modify said operational parameter of said processor.

5. The method of claim 1 , comprising sending a request to reduce the frequency of said processor based on the power of said processor.

6. The method of claim 1 , comprising modifying an operational parameter of a processing unit based on the power of said processor.

7. An apparatus comprising:

a controller to determine an operational parameter of a processor based on a temperature of a heat sink associated with the processor and modify the operational parameter of the processor based on the temperature of the heat sink, wherein said controller is to determine a power of said processor based on said temperature of the heat sink and based on a thermal resistance parameter.

8. The apparatus of claim 7 , wherein said controller is, if said temperature is higher than a pre-defined threshold value, to reduce an operational parameter selected from a group including a frequency of said processor, said power of said processor, a current of said processor, and a voltage of said processor.

9. The apparatus of claim 7 , wherein said controller is to send a request to modify said operational parameter of said processor.

10. The apparatus of claim 7 , wherein said controller is to send a request to reduce the frequency of said processor based on the power of said processor.

11. The apparatus of claim 7 , wherein said controller is to modify an operational parameter of a processing unit based on the power of said processor.

12. The apparatus of claim 7 , wherein said controller comprises a thermal management unit.

13. A computing platform comprising:

a processor;

a heat sink associated with said processor; and

a controller to determine an operational parameter of the processor based on a temperature of the heat sink and modify said operational parameter of said processor based on the temperature of said heat sink, wherein said controller is to determine a power of said processor based on said temperature of the heat sink and based on a thermal resistance parameter.

14. The computing platform of claim 13 , comprising a thermal sensor associated with a pre-defined location of said heat sink to sense said temperature.

15. The computing platform of claim 14 , wherein said thermal sensor is integrally formed with said heat sink.

16. The computing platform of claim 14 , wherein said controller is able to read said sensed temperature from said thermal sensor.

17. A machine-readable medium having stored thereon a set of instructions that, if executed by a machine, cause the machine to perform a method comprising:

determining an operational parameter of a processor based on a temperature of a heat sink associated with the processor;

determining a power of said processor based on said temperature of the heat sink and based on a thermal resistance parameter; and

modifying the operational parameter of the processor based on the temperature of the heat sink.

18. The machine-readable medium of claim 17 , wherein the instructions result in:

sensing said temperature of said heat sink at one or more pre-defined locations.

19. The machine-readable medium of claim 17 , wherein the instructions result in:

if said temperature is higher than a pre-defined threshold value, reducing an operational parameter selected from a group including a frequency of said processor, a power of said processor, a current of said processor, and a voltage of said processor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 14, 2005
From: ROTEM, EFRAIM; FINKELSTEIN, LEV
To: INTEL CORPORATION
Reel/Frame 016771/0078 →
Continuity (1)
Related Publication 20060136076A1 · Jun 22, 2006