Active matrix displays and other electronic devices having plastic substrates
A method of manufacturing an active matrix display device involves manufacturing a first substrate arrangement comprising a rigid glass substrate and an overlying plastic substrate. Pixel circuits are formed over the plastic substrate. The rigid glass substrate ( 12 ) is only removed from the plastic substrate after the mounting of the active and passive plates of the display into display modules ( 10 ). This method enables substantially conventional substrate handling, processing and cell making to be employed, for example in standard AMLCD factories, with only minimal extra equipment needed. A more general manufacturing method is also disclosed for fabricating TFTs on a spin-on plastic layer.
1. A thin film electronic device, comprising:
a parylene substrate;
thin film electronic elements disposed over the parylene substrate; and
an active matrix display, the thin film electronic elements defining active matrix pixel circuits, and the device further comprises a display layer over the active matrix pixel circuits.
2. A device as claimed in claim 1 , wherein the display layer comprises a selectively reflective display layer.
3. A device as claimed in claim 2 , wherein the selectively reflective display layer comprises electrophoretic material.
4. A device as claimed in claim 1 , wherein the display layer over the array of pixel circuits comprises an LED layer.
5. A device as claimed in claim 1 , further comprising a second substrate arrangement, and wherein the display layer comprises electro-optic material sandwiched between the first and second substrates.
6. A device as claimed in claim 5 , wherein the electro-optic material comprises LC material.