System and method for design and fabrication of a high frequency transducer
Techniques for fabricating high frequency ultrasound transducers are provided herein. In one embodiment, the fabrication includes depositing a copperclad polyimide film, a layer of epoxy on the copperclad polyimide film, and a polyvinylidene fluoride film on the epoxy. The assembly of materials are then pressed to bond the polyvinylidene fluoride film to the copperclad polyimide film and to form an assembly. The polyvinylidene fluoride film being one surface and the copperclad polyimide film being the other surface. The area behind the copperclad polyimide film surface is filled with a second epoxy, and then cured to form an epoxy plug.
1. A high frequency ultrasound transducer device, comprising: a copperclad polyimide film; a layer of epoxy bonded to a first surface of said copperclad polyimide film; a polyvinylidene fluoride film bonded to said layer of epoxy on a first side thereof to thereby form an assembly; and a second epoxy bonded to a second surface of said copperclad polyimide film surface to fabricate into said high frequency ultrasound transducer.
2. The device of claim 1 , wherein said polyvinylidene fluoride film bonded to said copperclad polyimide film having a curved shape, wherein said polyvinylidene fluoride film being a concave surface thereof and said copperclad polyimide film being a convex surface thereof.
3. The device of claim 2 , wherein said curved shape is spherically curved.
4. The device of claim 1 , wherein an array pattern is formed on said copperclad polyimide film and said arrays are electronically connected to transducer electrical traces.
5. The device of claim 4 , wherein said array pattern is an annular array pattern comprising a plurality of annuli.
6. The device of claim 5 , wherein said plurality of annuli comprises five rings.
7. The device of claim 4 , wherein printed circuit board traces are positioned on a printed circuit board and electronically connected to said transducer electrical traces allowing electronic access to said array pattern.
8. The device of claim 7 , wherein surface inductors are mounted on said printed circuit board and connected to said printed circuit board traces for impedance matching.
9. The device of claim 1 , wherein one side of said polyvinylidene fluoride film is coated in gold and acts as a ground plane.
10. The device of claim 1 , wherein a third epoxy joins a conductive side of said polyvinylidene fluoride film to a metal cap and metal connector to form a ground connection.
11. The device of claim 10 , wherein said third epoxy is a silver epoxy.