Thermally stable diamond brazing
View Patent ↗A cutting element and a method for forming a cutting element is described and shown. The cutting element includes a substrate, a TSP diamond layer, a metal interlayer between the substrate and the diamond layer, and a braze joint securing the diamond layer to the substrate. The thickness of the metal interlayer is determined according to a formula. The formula takes into account the thickness and modulus of elasticity of the metal interlayer and the thickness of the TSP diamond. This prevents the use of a too thin or too thick metal interlayer. A metal interlayer that is too thin is not capable of absorbing enough energy to prevent the TSP diamond from fracturing. A metal interlayer that is too thick may allow the TSP diamond to fracture by reason of bending stress. A coating may be provided between the TSP diamond layer and the metal interlayer. This coating serves as a thermal barrier and to control residual thermal stress.
1. A cutting element, comprising:
a substrate;
a cutting surface comprising a TSP diamond layer;
a metal interlayer between said substrate and said TSP diamond layer, wherein said metal interlayer has a thickness selected according to:
t
m
≈
1.05
*
10
6
λ
*
t
d
.14
,
wherein, t m is the thickness of said metal interlayer, t d is the thickness of said TSP diamond layer, and λ is the modulus of elasticity of said metal interlayer; and
a braze joint securing said TSP diamond layer to said substrate, said braze joint having a shear strength greater than about 80,000 psi.
2. The cutting element of claim 1 , wherein said metal interlayer comprises tungsten, molybdenum, nickel, SS430, tantalum, INVAR, titanium, niobium, or zirconium.
3. The cutting element of claim 1 , wherein said braze joint has a thickness less than about 0.003 inches.
4. The cutting element of claim 1 , wherein said braze joint comprises a NiPdCr braze alloy.
5. The cutting element of claim 1 , wherein said braze joint comprises a braze alloy comprising at least one or more elements selected from the group consisting of Cr, Fe, Si, C, B, P, Mo, Ni, Co, W, and Pd.
6. The cutting element of claim 1 , further comprising a MO 5 Si 3 C 1−x carbide coating between said TSP diamond layer and said braze joint.
7. The cutting element of claim 1 , further comprising a coating between said TSP diamond layer and said braze joint, wherein said coating comprises a metal selected from the group consisting of Ru, W, and Ta.
8. The cutting element of claim 1 , wherein said metal interlayer comprises a metal selected from the group consisting of Mo and Ni.
9. The cutting element of claim 1 , further comprising a coating between said TSP diamond layer and the braze joint, said coating being a thermal barrier between said TSP diamond layer and said braze joint.
10. A cutting element, comprising:
a substrate;
a cutting surface comprising a TSP diamond layer;
a shock absorbing interlayer between said substrate and said TSP diamond layer, wherein said shock absorbing interlayer has a thickness, said thickness being about:
t
m
≈
1.05
*
10
6
λ
*
t
d
.14
,
wherein, t m is the thickness of said shock absorbing interlayer, t d is the thickness of said TSP diamond layer, and λ is the modulus of elasticity of said shock absorbing interlayer.
11. The cutting element of claim 10 , further comprising a braze joint interposed between said substrate and said TSP diamond layer, a coating between said TSP diamond layer and said braze joint, said coating being adapted to being a thermal barrier between said TSP diamond layer and said braze joint.
12. The cutting element of claim 10 , further comprising a braze joint interposed between said substrate and said TSP diamond layer, a coating between said TSP diamond layer and said braze joint, said coating being adapted to control residual thermal stress.
13. The cutting element of claim 10 , further comprising a braze joint interposed between said substrate and said TSP diamond layer, wherein said braze joint has a shear strength of greater than about 60,000 psi.
14. The cutting element of claim 10 , wherein said metal interlayer comprises tungsten, molybdenum, nickel, SS430, tantalum, INVAR, titanium, niobium, or zirconium.
15. A cutting element, comprising:
a substrate;
a cutting surface comprising a TSP diamond layer; and
a metal interlayer between said substrate and said TSP diamond layer, said metal interlayer having a thickness that it is adapted to absorbing enough energy to prevent said TSP diamond layer from fracturing without subjecting said TSP diamond layer to bending stress, said thickness being about
t
m
≈
1.05
*
10
6
λ
*
t
d
.14
,
wherein, t m is the thickness of said metal interlayer, t d is the thickness of said TSP diamond layer, and λ is the modulus of elasticity of said metal interlayer.