Heat dissipating device
A heat dissipating device which dissipates heat generated by a heat generating object mounted on a base includes a heat sink body, a heat-conducting area, a tip portion, an inclined surface, and a fastener. The heat-conducting area includes the tip portion, which is a substantially middle portion of the heat-conducting area and is arranged substantially closest to the heat generating object among the other areas of the heat-conducting area, and the inclined surface which is a part of the heat-conducting area and inclines outwardly from the tip portion such that a distance between the inclined surface and the heat generating object gradually increases. The fastener includes an attaching portion to mount the heat dissipating device to the base, and the attaching portion is arranged substantially radially outside of an outer peripheral portion of the heat generating object. When the attaching portion is secured to the base, the tip portion of the heat-conducting area is pressed to the heat generating object.
1. A heat dissipating device arranged to dissipate heat generated by a heat generating object mounted on a base, comprising:
a heat sink body;
a plurality of heat sink fins integral with the heat sink body;
a heat-conducting area arranged to be pressed to a substantially flat surface of the heat generating object;
a tip portion arranged approximately at a middle of the heat-conducting area and closest to the heat generating object among other areas of the heat-conducting area;
an inclined surface of the heat-conducting area inclined outwardly from the tip portion such that a distance between the inclined surface and the heat generating object gradually increases in a state when the heat dissipating device is placed on the heat generating object; and
a fastener including an attaching portion arranged to mount the heat dissipating device to the base, the attaching portion being arranged substantially radially outside of an outer peripheral portion of the heat generating object; wherein
a distance between the attaching portion and the base is greater than a distance between the tip portion and the heat generating object in a state when the heat dissipating device is placed on the heat generating object such that when the heat dissipating device is mounted to the base, the base is bent.
2. The heat dissipating device as set forth in claim 1 , wherein the heat-conducting area is substantially cone-shaped, and a vertex of the substantially cone-shaped heat-conducting area includes the tip portion of the heat-conducting area.
3. The heat dissipating device as set forth in claim 1 , wherein a height of the tip portion from the heat-conducting area is about 200 μm or less.
4. The heat dissipating device as set forth in claim 3 , further comprising a core, wherein the heat sink body includes a through hole or a concave portion, the core is attached to the through hole or the concave portion, and the heat-conducting area is arranged on the core.
5. The heat dissipating device as set forth in claim 3 , wherein a thermal conductive member is arranged between the heat-conducting area and the heat generating object.
6. The heat dissipating device as set forth in claim 1 , wherein the heat-conducting area has a substantially truncated cone-shape, and a truncated surface of the substantially truncated cone-shaped heat-conducting area includes the tip portion of the heat-conducting area.
7. The heat dissipating device as set forth in claim 6 , wherein a height of the substantially truncated cone-shaped heat-conducting area is about 200 μm or less.
8. The heat dissipating device as set forth in claim 7 , further comprising a core, wherein the heat sink body includes a through hole or a concave portion, the core is attached to the through hole or the concave portion, and the heat-conducting area is arranged on the core.
9. The heat dissipating device as set forth in claim 7 , wherein a thermal conductive member is arranged between the heat-conducting area and the heat generating object.
10. The heat dissipating device as set forth in claim 1 , wherein the heat-conducting area has a substantially spherical segmented-shape, and a vertex of the substantially spherical segmented-shaped heat-conducting area defines the tip portion of the heat-conducting area.
11. The heat dissipating device as set forth in claim 10 , wherein a vertical height of the substantially spherical segmented-shaped heat-conducting area is about 200 μm or less.
12. The heat dissipating device as set forth in claim 11 , further comprising a core, wherein the heat sink body includes a through hole or a concave portion, the core is attached to the through hole or the concave portion, and the heat-conducting area is arranged on the core.
13. The heat dissipating device as set forth in claim 11 , wherein a thermal conductive member is arranged between the heat-conducting area and the heat generating object.
14. The heat dissipating device as set forth in claim 1 , further comprising the base, the base being a circuit board, a socket on which the heat generating object is mounted, or a casing of an electronic device.
15. The heat dissipating device as set forth in claim 1 , further comprising a cooling fan arranged to provide an air flow to the heat sink fins such that the heat diffused to the heat sink fins is actively dissipated.
16. The heat dissipating device as set forth in claim 15 , further comprising a casing, wherein the casing accommodates the heat sink body, the heat sink fins, and the cooling fan.
17. The heat dissipating device as set forth in claim 16 , wherein the fastener is provided as a portion of the casing.
18. The heat dissipating device as set forth in claim 1 , wherein the heat-conducting area includes a cut surface shaped by a cutting process.
19. The heat dissipating device as set forth in claim 1 , further comprising a core, wherein the heat sink body includes a through hole or a concave portion, the core is attached to the through hole or the concave portion, and the heat-conducting area is arranged on the core.
20. The heat dissipating device as set forth in claim 1 , wherein a thermal conductive member is arranged between the heat-conducting area and the heat generating object.
21. The heat dissipating device as set forth in claim 1 , wherein a vertical distance between the tip portion and a distal end portion of the heat-conducting area in the radial direction is about 200 μm or less.