Method for eliminating punctual defects comprised in an electrochemical device
A method of eliminating, using a beam of laser radiation, defects lying within a laminate formed from at least a first substrate and from at least a second substrate. The laminate incorporates, between the first and second substrates, at least one smart active system. The method locates at least one defect lying within the active system and ablates the defect, by circumscribing the defect using a laser beam.
1. A method of eliminating, using a laser beam of laser radiation, pinhole defects lying within a laminate formed from at least a first substrate and from at least a second substrate, the laminate incorporating, between the first and second substrates, at least one active system, the method comprising:
locating at least one pinhole defect lying within the active system; and
ablating the pinhole defect through at least one of the first or second substrates, by circumscribing the pinhole defect using the laser beam, the ablating the defect electrically isolating a peripheral region of the pinhole defect relative to the active system including the pinhole defect.
2. The method as claimed in claim 1 , wherein the pinhole defect is circumscribed using a continuous laser beam.
3. The method as claimed in claim 1 , wherein the pinhole defect is circumscribed using a number of laser pulses.
4. The method as claimed in claim 1 , wherein the locating the pinhole defect is carried out by an optical mechanism, either manually by human intervention or automatically using image processing software.
5. The method as claimed in claim 1 , wherein the ablating the pinhole defect moves the laser beam to follow approximately a periphery of the pinhole defect.
6. The method as claimed in claim 1 , wherein a wavelength of the laser beam is adapted so that the laser beam is absorbed by layers forming the active system and transmitted through the first and second substrates.
7. The method as claimed in claim 1 , wherein the ablating the pinhole defect is carried out through the first substrate.
8. The method as claimed in claim 1 , wherein ablating the pinhole defect is carried out through the second substrate.
9. The method as claimed in claim 1 , further comprising pinpointing the pinhole defect using at least a first laser beam pulse.
10. The method as claimed in claim 9 , wherein the pinpointing incorporates resetting the laser beam according to a deviation between the at least first pulse and the pinhole defect.
11. The method as claimed in either of claim 10 , wherein the pinpointing is carried out using a lower power level of the laser beam than during the ablating.
12. A glazing comprising:
at least one of an electrochemical device or an electrically controllable system of glazing type with variable optical and/or energy properties, of a photovoltaic device or within an electroluminescent device, the electrochemical device being inserted between two electrodes positioned on either side, the electrochemical device including a pinhole defect ablated at its peripheral region, wherein a value of leakage current is reduced by a factor of 10 at a core of margination of the glazing.