IP Library › Granted Patent US 7,539,007
Granted Patent B2
US 7,539,007 · App. 11/321,358 · Granted May 26, 2009

Methods and structures for electrically coupling a conductor and a conductive element comprising a dissimilar material

Assignee: Medtronic, Inc.
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Quick Facts
Patent No.
US 7,539,007
App. No.
11/321,358
Granted
May 26, 2009
Kind
B2
Abstract

Methods and structures are provided for electrically coupling a conductor and a conductive element containing a dissimilar material. A method for electrically coupling a first element containing a first conductive material to a conductor formed of a dissimilar second material includes cladding a second conductive element with the conductor. The second element contains a facilitator material that facilitates the melting of the dissimilar material. A third element containing a third conductive material that is metallurgically compatible with the facilitator material is cladded with a fourth element containing a fourth conductive material that is metallurgically compatible with the first conductive material to form a connector. The fourth element is welded to the first element and the second element is welded to the third element.

Claims (24)

1. A method for electrically coupling a first conductive element formed of a first conductive material to a conductor formed of a dissimilar second material, the method comprising the steps of:

cladding a second conductive element with the conductor, the second conductive element comprising a facilitator material that facilitates the melting of the second material;

cladding a third conductive element comprising a third material that is metallurgically compatible with the facilitator material with a fourth conductive element comprising a fourth material that is metallurgically compatible with the first conductive material to form a connector; and

welding the fourth conductive element and the first conductive element; and

welding the second conductive element and the third conductive element such that the conductor welds to the third conductive element.

2. The method of claim 1 , wherein the step of cladding a third conductive element comprising a third material that is metallurgically compatible with the facilitator material with a fourth conductive element comprising a fourth material that is metallurgically compatible with the first conductive material comprises the step of cladding the third conductive element comprising the facilitator material with the fourth conductive element.

3. The method of claim 1 , the step of cladding a second conductive element with the conductor comprises the step of cladding the second conductive element comprising nickel with a conductor comprising copper.

4. The method of claim 1 , wherein the step of cladding a third conductive element comprising a third material that is metallurgically compatible with the facilitator material with a fourth conductive element comprising a fourth material that is metallurgically compatible with the first conductive material comprises the step of cladding the third conductive element with the fourth conductive element comprising the first conductive material.

5. The method of claim 1 , wherein the first conductive material comprises titanium and wherein wherein the step of cladding a third conductive element comprising a third material that is metallurgically compatible with the facilitator material with a fourth conductive element comprising a fourth material that is metallurgically compatible with the first conductive material comprises the step of cladding the third conductive element with the fourth conductive element comprising titanium.

6. The method of claim 1 , further comprising the step of shaping the connector by stamping or machining.

7. The method of claim 1 , further comprising the step of plating at least a portion of the connector with a material that facilitates welding.

8. The method of claim 1 , further comprising the step of encapsulating a portion of the connector in a polymer material.

9. The method of claim 1 , wherein the step of cladding a third conductive element comprising a third material that is metallurgically compatible with the facilitator material with a fourth conductive element comprising a fourth material that is metallurgically compatible with the first conductive material comprises the step of cladding the third conductive element so that the third conductive element is inlaid within the fourth conductive element.

10. The method of claim 1 , wherein the step of cladding a third conductive element comprising a third material that is metallurgically compatible with the facilitator material with a fourth conductive element comprising a fourth material that is metallurgically compatible with the first conductive material comprises the step of cladding a fifth element with the third conductive element and the fourth conductive element.

11. The method of claim 10 , wherein the step of cladding a fifth element with the third conductive element and the fourth conductive element comprises the step of cladding the fifth element as an interlayer disposed between the third conductive element and the fourth conductive element.

12. The method of claim 1 , wherein the step of cladding a third conductive element comprising a third material that is metallurgically compatible with the facilitator material with a fourth conductive element comprising a fourth material that is metallurgically compatible with the first conductive material comprises the step of cladding by hot roll cladding, hot press cladding, explosive cladding, fusion cladding, chemical vapor deposition, sputtering, or physical vapor deposition (PVD).

13. A method for electrically coupling a housing component of an electrochemical cell to a conductor, wherein the housing component comprises a first conductive material and the conductor comprises a dissimilar conductive material, the method comprising the steps of:

bonding a first conductive element comprising a second conductive material to the conductor, wherein the second conductive material is metallurgically compatible or bondable with the dissimilar conductive material of the conductor;

cladding a second conductive element comprising the second conductive material to a third conductive element comprising the first conductive material to form a connector;

welding the first conductive element and the second conductive element; and

welding the third conductive element and the housing component.

14. The method of claim 13 , wherein the step of bonding a first conductive element to the conductor comprises the step of bonding the first conductive element and the conductor by laser welding, resistance welding, ultrasonic welding, or soldering.

15. The method of claim 13 , wherein the step of bonding a first conductive element to the conductor comprises the step of bonding a first conductive element comprising nickel to a conductor comprising copper.

16. The method of claim 13 , wherein the step of bonding a first conductive element to the conductor comprises the step of bonding the first conductive element to an electrode disposed within the electrochemical cell.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2007
From: ZHAO, HAILIANG; MAY, STEVE J.; LUND, JEFFREY S.; CASBY, KURT J.
To: MEDTRONIC, INC.
Reel/Frame 019493/0807 →
Continuity (1)
Related Publication 20070155149A1 · Jul 5, 2007