IP Library › Granted Patent US 7,548,108
Granted Patent B2
US 7,548,108 · App. 10/761,239 · Granted Jun 16, 2009

Semiconductor integrated circuit device with dual insulation system

Assignee: Sumsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 7,548,108
App. No.
10/761,239
Granted
Jun 16, 2009
Kind
B2
Abstract

A semiconductor integrated circuit device may include a first internal circuit operating at a first voltage higher than a power supply voltage of the device, and a second internal circuit operating at a second voltage lower than the first voltage. An interface circuit may be provided to restrict a voltage transferred from the first internal circuit to the second internal circuit. The first internal circuit may include a metal oxide semiconductor (MOS) transistor having a relatively thick gate insulation layer, and the second internal circuit may have a MOS transistor having a relatively thin gate insulation layer. The interface circuit, by restricting voltage, may reduce an electric field applied to the gate insulation layer of the second MOS transistor in an effort to prevent a reduction in turn-on speed of the second MOS transistor.

Claims (29)

1. A semiconductor integrated circuit device, comprising:

a power terminal receiving a high voltage higher than a power supply voltage of the device;

a first MOS transistor coupled between the power terminal and a first internal node, the first internal node coupled to a row decoder and driver block of a memory device, and the row decoder and driver block selectively drives word lines of the memory device in response to a row address signal;

a second MOS transistor coupled between the power terminal and a second internal node,

a third MOS transistor, having a relatively thin gate insulation layer, coupled between the first internal node and a third internal node;

a fourth MOS transistor, having a relatively thin gate insulation layer, coupled between the second internal node and a fourth internal node;

a fifth MOS transistor coupled between the third internal node and a ground voltage, the fifth MOS transistor controlled by a first input signal, and the first input signal includes the row address signal and a block selecting signal from the memory device; and

a sixth MOS transistor coupled between the fourth internal node and the ground voltage, the sixth MOS transistor controlled by an inverted version of the first input signal.

2. The device of claim 1 , wherein

the first MOS transistor and the second MOS transistor each have a relatively thick gate insulation layer, and

the fifth MOS transistor and sixth MOS transistor each have a relatively thin gate insulation layer.

3. The device of claim 1 , wherein

the power supply voltage is an external power supply voltage for the device or an internal power supply voltage of the device.

4. The device of claim 1 , wherein the first MOS transistor is controlled by a voltage of the second internal node, and the second MOS transistor is controlled by a voltage of the first internal node.

5. The device of claim 1 , wherein gates of the third and fourth MOS transistors are coupled to a low voltage that is lower than the high voltage.

6. The device of claim 5 , wherein

the power supply voltage is an external power supply voltage for the device or an internal power supply voltage of the device, and

the low voltage is one of the power supply voltage, a voltage lower than the power supply voltage, and a voltage between the power supply voltage and the high voltage.

7. The device of claim 1 , wherein the first input signal and its inverted version are selectable to have one of a high level of a low voltage and a low level of the ground voltage.

8. The device of claim 1 , wherein

the row decoder and driver block includes a plurality of row decoder and driver circuits, each row decoder and driver circuit corresponding to a given word line, and

each row decoder and driver circuit further including:

a seventh MOS transistor having a source coupled to the high voltage, a drain coupled to a fifth internal node, and a gate connected to receive a second input signal; and

eighth and ninth MOS transistors serially coupled between the fifth internal node and the ground voltage,

wherein each of the seventh and eighth MOS transistors has a relatively thick gate insulation layer, and the ninth MOS transistor has a relatively thin gate insulation layer; and

wherein the eighth MOS transistor is controlled by a voltage of the first internal node.

9. The device of claim 8 , further comprising:

an inverter coupled to the corresponding fifth internal node, wherein the inverter drives the corresponding word line of each of the row decoder and driver circuits.

10. The device of claim 9 , wherein the inverter includes PMOS and NMOS transistors, each PMOS or NMOS transistor operating at another voltage higher than the power supply voltage and having a relatively thick gate insulation layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2004
From: CHOI, JONG-HYUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 014916/0586 →
Priority Claims (1)
KR 10-2003-0008200 · Feb 10, 2003 · national
Continuity (1)
Related Publication 20040184338A1 · Sep 23, 2004