IP Library › Granted Patent US 7,558,073
Granted Patent B2
US 7,558,073 · App. 10/952,715 · Granted Jul 7, 2009

Multifunctional peripheral device

Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 7,558,073
App. No.
10/952,715
Granted
Jul 7, 2009
Kind
B2
Abstract

A multifunctional apparatus includes a first circuit board which is installed on a low surface of a main body, receives a current from an external power source and supplies the current to other circuit boards and devices; a second circuit board which is installed on a surface of the main body and includes a controller to control the other circuit boards and devices; and a third circuit board which is installed on an upper surface of the main body and supplies the current or transfers control signals to a scanning unit.

Claims (10)

1. A multifunctional apparatus comprising:

a main body having first, second and third surfaces;

a first circuit board which is installed on the first surface of the main body, receives a current from an external power source and supplies the current;

a second circuit board which is installed on the second surface of the main body and receives the supplied current from the first circuit board, comprising a controller to generate control signals to control the first circuit boards and a scanning unit; and

a third circuit board which is installed on the third surface of the main body, and receives the current supplied from the first circuit board directly from the second circuit board and the control signals from the second circuit board, and to supply the received current or control signals to the scanning unit,

wherein the second circuit board has two sides respectively disposed perpendicularly to the first and third surfaces of the main body and is placed as close as possible to upper and lower sides of the second surface of the main body, and

wherein the second circuit board is directly adjacent to the first and third circuit boards without intervening elements affecting the spacing between the second circuit board and the first and third circuit boards.

2. The apparatus of claim 1 , wherein the first, second, and third circuit boards are disposed in a “C” shape.

3. The apparatus of claim 1 , wherein the second circuit board is disposed parallel with the second surface of the main body.

4. The apparatus of claim 1 , further comprising a plurality of connecting units to respectively electrically connect the first, second, and third circuit boards.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 21, 2017
From: SAMSUNG ELECTRONICS CO., LTD
To: S-PRINTING SOLUTION CO., LTD.
Reel/Frame 041852/0125 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2004
From: LIM, JEONG-PIL; KWAK, IN-GU
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 015859/0488 →
Priority Claims (1)
KR 10-2003-0068661 · Oct 2, 2003 · national
Continuity (1)
Related Publication 20050073820A1 · Apr 7, 2005