Bonding structure
A bonding structure including a first substrate, a second substrate, a non-conductive adhesive layer, and ball-shaped spacers is provided. The first substrate has first bonding pads. The second substrate is disposed on one side of the first substrate, and includes second bonding pads and compliant bumps disposed on the second bonding pads, respectively. The second bonding pads on the second substrate are electrically connected to the first bonding pads on the first substrate through the compliant bumps, respectively. The non-conductive adhesive layer is sandwiched between the first substrate and the second substrate. The ball-shaped spacers are distributed in the non-conductive adhesive layer to maintain the gap between the first and second substrates.
1. A bonding structure, comprising:
a first substrate comprising a plurality of first bonding pads;
a second substrate disposed on one side of the first substrate and including a plurality of second bonding pads and a plurality of compliant bumps disposed on the second bonding pads, respectively, wherein the second bonding pads on the second substrate are electrically connected to the first bonding pads on the first substrate through the compliant bumps, respectively;
a non-conductive adhesive layer disposed between the first substrate and the second substrate; and
a plurality of ball-shaped spacers distributed in the non-conductive adhesive layer to maintain the gap between the first and second substrates, wherein the ball-shaped spacers are nonconductive.
2. The bonding structure of claim 1 , wherein the first substrate comprises a silicon substrate, a glass substrate, a printed circuit board, a flexible circuit board, a ceramic substrate, an organic substrate, or an inorganic substrate.
3. The bonding structure of claim 1 , wherein the second substrate comprises a silicon substrate, a glass substrate, a printed circuit board, a flexible circuit board, an organic substrate, or an inorganic substrate.
4. The bonding structure of claim 1 , wherein each of the compliant bumps comprises a polymer bump and a conductive metal layer covering the polymer bump.
5. The bonding structure of claim 1 , wherein in the cross-section of each of the compliant bumps parallel to a surface of the first substrate, the length of the narrowest edge of each of the compliant bumps is smaller than the diameter of each of the ball-shaped spacers.
6. The bonding structure of claim 1 , wherein the height of each of the compliant bumps exceeds the diameter of each of the ball-shaped spacers.
7. The bonding structure of claim 1 , wherein the non-conductive adhesive layer comprises a non-conductive paste or a non-conductive film.
8. The bonding structure of claim 1 , wherein the insulating material comprises an organic material or an inorganic material.
9. The bonding structure of claim 8 , wherein the organic material comprises a polymer.
10. The bonding structure of claim 9 , wherein the polymer comprises epoxy resin or polyimide.
11. The bonding structure of claim 8 , wherein the inorganic material comprises SiO 2 or TiO 2 .