Imaging device package camera module and camera module producing method
An IR cut-filter is fitted into a support portion within the optical-system containing portion of a ceramic board and a lens 11 is mounted in the ceramic board by screwing the lens. In an imaging-device containing portion, an imaging device with a light receiving portion arranged therein is mounted outside the support portion by flip-chip packaging. Further, the vicinity of the flip-chip packaging portion is sealed with resin. Additionally, on the base of the imaging-device containing portion of a ceramic package, the lands of an imaging device are so positioned as to correspond to the respective land positions of a ceramic package and patterns are electrically connected by melting a gold bump, whereby the imaging device is mounted by bare-chip packaging. The land portion is filled with an underfill agent and then sheet glass is mounted on a through-hole 5 b and sealed with a sealing agent, so that the through-hole 5 b for containing a light receiving portion is sealed up.
1. A small-sized module camera comprising:
a board having a through-hole, whereby to form an optical-system containing portion for containing an optical filter and a lens on the upper side of the through-hole and an imaging-device containing portion for containing an imaging device on the lower side of the through-hole;
the lens mounted on the top surface side of the board;
the imaging device mounted on the undersurface side of the board and used for receiving an image which is picked up through the lens; and
a support portion for supporting the optical filter between the optical-system containing portion and the imaging-device containing portion provided so that the support portion is projected on the imaging-device containing portion side,
wherein the imaging device and a land portion of the board are at a portion outside the support portion of the imaging-device containing portion.
2. A small-sized module camera as claimed in claim 1 , wherein the imaging device is contained in the imaging-device containing portion so that the undersurface of the imaging device is positioned inside the underside of the through-hole of the board; and
solder lands are provided around the board.
3. A small-sized module camera as claimed in claim 1 ,
wherein the board has a layer capable of forming electrical passive elements inside.
4. A small-sized module camera as claimed in claim 1 , wherein an internal reflection preventive process is applied to the inner wall of the imaging-device containing portion.
5. A small-sized module camera as claimed in claim 1 , wherein threads are respectively formed on the peripheral face of the lens and the inner wall of the imaging-device containing portion; and
the lens is fitted to the optical-system containing portion by screwing the lens in.